LEAPS-MPS: Solution Processed 2D Tellurene with Outstanding Thermoelectric Properties

LEAPS-MPS：具有出色热电性能的溶液处理二维碲烯

• 批准号: 2213441
• 负责人: Heng Wang
• 金额: $ 23.68万
• 依托单位: Illinois Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-07-01 至 2024-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2213441&HistoricalAwards=false
• 关键词: LEAPS; MPS; Solution; Processed; 2D

Non-technical Description. Providing precise, localized temperature control is important for many applications, such as to keep microprocessors from overheating and for medical equipment. This is often realized with thermoelectric devices where cooling and heating are performed by special semiconductors. Thermoelectric devices also have the potential for renewable energy, yet cost and efficiency limitations have precluded widespread use. While other semiconductor devices have seen dramatic increases in performance through materials advances, thermoelectric devices still use the same materials as decades ago. This project explores a new pathway to thermoelectrics, taking advantage of recent progress in low-dimensional materials and a novel synthesis technique. This research has the potential for profound impact in many technical areas. The research activities advance knowledge on the control of electrical and thermal transport in two-dimensional semiconductors as well as how to preserve the merit of these materials when they are assembled into bulk forms. The project promotes the education and training of next-generation workforce in semiconductor engineering. These include community-focused, in-person and virtual outreach programs, which serve primarily underprivileged groups on the south side of Chicago.Technical Description. This research project explores tellurene for thermoelectrics, based on a favorable electronic band structure in its two-dimensional form. A large number of degenerate bands is the key feature for better thermoelectric performance. This activity advances research on similar materials for thermoelectric and other applications. Ligand removal will be systematically studied to minimize interface influence on electrical transport. Carrier density tuning, a challenging problem for 2D semiconductors, will be addressed by a surface doping scheme.The use of inorganic binders allows mild-temperature assembly to preserve nanoscale features. Electrical and thermal transport property characterizations are complemented with Boltzmann transport modeling, which provides deep understanding on the unique features of tellurene. Knowledge generated through this research will provide insights on future materials design for thermoelectric and other device applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

非技术描述。提供精确的局部温度控制对于许多应用都很重要，例如防止微处理器过热和医疗设备。这通常通过热电装置来实现，其中冷却和加热由特殊的半导体执行。热电装置也具有可再生能源的潜力，但由于成本和效率的限制，无法广泛使用。虽然其他半导体器件通过材料的进步在性能上有了显著的提高，但热电器件仍然使用与几十年前相同的材料。该项目利用低维材料的最新进展和新的合成技术，探索了一条新的热电途径。这项研究有可能在许多技术领域产生深远的影响。这些研究活动促进了对二维半导体中电和热传输控制的了解，以及如何在组装成块状时保持这些材料的优点。该项目促进半导体工程下一代劳动力的教育和培训。其中包括以社区为中心的面对面和虚拟外展计划，主要服务于芝加哥南部的弱势群体。技术说明本研究项目基于其二维形式的有利电子能带结构，探索碲的热电性能。大量的简并带是获得较好热电性能的关键特征。这项活动推动了对热电和其他应用的类似材料的研究。将系统地研究配体去除，以尽量减少界面对电输运的影响。载子密度调整，二维半导体的一个挑战性问题，将通过表面掺杂方案来解决。无机粘合剂的使用允许温和的温度组装，以保持纳米尺度的功能。电学和热学输运性质的表征与玻尔兹曼输运模型相结合，从而深入了解碲的独特功能。通过这项研究产生的知识将为热电和其他设备应用的未来材料设计提供见解。该奖项反映了NSF的法定使命，并且通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

Performance Optimization of Thermoelectric Devices and its Dependence on Materials Properties

热电器件的性能优化及其对材料特性的依赖性

• DOI: 10.54227/mlab.20220053
• 发表时间: 2022
• 期刊: Materials Lab
• 作者: Wang, Heng