课题基金 / 基金详情

FMSG: Cyber: Perceptual and Cognitive Additive Manufacturing (PCAM)

FMSG: Cyber: Perceptual and Cognitive Additive Manufacturing (PCAM)
FMSG:网络:感知和认知增材制造 (PCAM)
批准号:
2229155
负责人:
Daewon Kim
金额:
$50.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2023
资助国家:
美国
项目状态:
已结题
起止时间:
2023-01-15 至 2024-12-31

项目摘要

项目成果

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中文摘要
翻译
这笔赠款支持通过数字连接机器、人和制成品实现加法制造的根本性转变的基础研究。加法制造实现了一种新的范式转变,从传统的面向制造的设计方法转变为面向设计的制造。随着我们进入一个超越加法制造的智能未来制造的新时代,加法制造的根本性变革是必要的。一个有前景的解决方案是将无线嵌入式传感器与人工智能(AI)和机器学习(ML)数据处理相结合,这可以改变人们与制造流程、工厂运营、优化效率和异常系统检测的交互方式,从而提供有关评估的组件和系统的关键信息。该项目为感知和认知加法制造打开了一扇新的过渡之门,实现了真正的物联网和数字孪生兄弟,将工厂中的设备和机器与机器人、计算机和人类以及我们在工厂制造的每一种产品连接起来。这笔赠款还将支持提高制造业劳动力、K-12、本科生和研究生以及公众技能的教育活动,对所有年龄和背景的不同人群产生重大影响。向网络物理生产制造的转变要求通过分布式传感进行先进的过程监控,超越数字连接的机器和机器人与人类协作的当前状态。该项目寻求通过嵌入无线传感器,并使用AI和ML技术执行预测分析和健康监测,从而实现前所未有的无线指纹识别和对额外制造的部件进行传感。该项目提出了一种全面的方法,涉及四个核心研究任务:1)研究添加制造过程中嵌入传感器的影响;2)设计可嵌入的声学传感器并在制造过程中将其插入以读取物理参数;3)证明嵌入式无源传感器信号可以使用毫米波天线进行无线传感;4)使用ML算法快速监测和评估制造产品的状态。该项目有可能实现下一代网络物理生产系统。这一未来制造奖由工程部(ENG)的电气、通信和网络系统部(ECCS)和计算机和信息科学与工程部(CEISE)的计算机和网络系统部(CNS)支持。该奖项反映了NSF的法定使命,并通过使用基金会的智力优势和更广泛的影响审查标准进行评估,被认为值得支持。
英文摘要
This grant supports fundamental research on a radical transformation of additive manufacturing through digitally connecting machines, humans, and manufactured products. Additive manufacturing has enabled a new paradigm shift from conventional design for manufacturing approaches into manufacturing for design. A fundamental change in additive manufacturing is necessary as we enter a new era of intelligent future manufacturing beyond additive manufacturing. A promising solution is the convergence of wireless embedded sensors with artificial intelligence (AI) and machine learning (ML) data processes, which can transform the way people interact with manufacturing processes, factory operations, optimizing efficiency, and anomaly system detection that could provide critical information about evaluated components and systems. This project opens a new transitional door to perceptive and cognitive additive manufacturing, enabling true internet of things and digital twin, connecting devices and machines in factories with robots, computers, and humans, and every product we manufacture in factories. The grant will also support educational activities to upskill the manufacturing workforce, K-12, undergraduate and graduate students, and the public, significantly influencing diverse populations of all ages and backgrounds. Transformation to cyber-physical production manufacturing demands advanced process monitoring through distributed sensing beyond the current state of digitally connected machines and robots collaborating with humans. This project seeks to enable unprecedented wireless fingerprinting and sensing of additively manufactured parts by embedding wireless sensors and performing predictive analysis and health monitoring using AI and ML techniques. This project proposes a holistic approach involving four core research tasks: 1) to study the effects of embedding sensors during additive manufacturing; 2) to design embeddable acoustic sensors and insert them during the manufacturing process to read physical parameters; 3) to prove that embedded passive sensor signals can be sensed wirelessly using millimeter-wave antennas, and 4) to quickly monitor and evaluate the state of manufactured products using ML algorithms. This project has the potential to enable next-generation cyber-physical production systems. This Future Manufacturing award is supported by the Division of Electrical, Communications and Cyber Systems (ECCS) in the Directorate for Engineering (ENG) and the Division of Computer and Network Systems (CNS) of the Directorate for Computer and Information Science and Engineering (CISE).This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
期刊论文(6)
专著(0)
科研奖励(0)
会议论文
Electrode filling using capillary action of 3D printed elastomer microchannels
利用 3D 打印弹性体微通道的毛细管作用填充电极
DOI: 10.1117/12.2658146
发表时间: 2023
期刊: SPIE
影响因子: --
作者: [Stark, Taylor, Kim, Daewon]
通讯作者: Kim, Daewon
DOI: 10.1117/12.2658076
发表时间: 2023-04
期刊:
影响因子: --
作者: [Rishikesh Srinivasaraghavan Govindarajan;F. Madiyar;Daewon Kim]
通讯作者: Rishikesh Srinivasaraghavan Govindarajan;F. Madiyar;Daewon Kim
DOI: 10.1117/12.2658143
发表时间: 2023-04
期刊:
影响因子: --
作者: [T. Stark;Stanislav Sikulskyi;Rishikesh Srinivasaraghavan Govindarajan;Daewon Kim]
通讯作者: T. Stark;Stanislav Sikulskyi;Rishikesh Srinivasaraghavan Govindarajan;Daewon Kim
DOI: 10.1117/12.2658072
发表时间: 2023-04
期刊:
影响因子: --
作者: [Rishikesh Srinivasaraghavan Govindarajan;T. Stark;F. Madiyar;Daewon Kim]
通讯作者: Rishikesh Srinivasaraghavan Govindarajan;T. Stark;F. Madiyar;Daewon Kim
MRI: Acquisition of a Photonic Nanofabrication System
国内基金
海外基金
Cyber体系脆弱性仿真分析方法研究
  • 批准号:
    61403400
  • 项目类别:
    青年科学基金项目
  • 资助金额:
    24.0万元
  • 批准年份:
    2014
  • 负责人:
    许相莉
  • 依托单位:
基于复杂网络理论的Cyber体系效能仿真分析方法研究
  • 批准号:
    61374179
  • 项目类别:
    面上项目
  • 资助金额:
    77.0万元
  • 批准年份:
    2013
  • 负责人:
    胡晓峰
  • 依托单位:
面向智能电网基础设施Cyber-Physical安全的自治愈基础理论研究
  • 批准号:
    61300132
  • 项目类别:
    青年科学基金项目
  • 资助金额:
    23.0万元
  • 批准年份:
    2013
  • 负责人:
    王竹晓
  • 依托单位:
Cyber攻击对国家关键基础设施级联失效影响建模仿真研究
  • 批准号:
    61174035
  • 项目类别:
    面上项目
  • 资助金额:
    58.0万元
  • 批准年份:
    2011
  • 负责人:
    贺筱媛
  • 依托单位: