Student Travel Support for the 2023 IEEE/ASME International Conference on Advanced Intelligent Mechatronics; Seattle, Washington; June 28 to July 1, 2023
Student Travel Support for the 2023 IEEE/ASME International Conference on Advanced Intelligent Mechatronics; Seattle, Washington; June 28 to July 1, 2023
批准号:
2245052
负责人:
Juan Ren
金额:
$2.08万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2023
资助国家:
美国
项目状态:
已结题
起止时间:
2023-01-01 至 2023-12-31
中文摘要
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英文摘要
This grant provides funding to support a Student Travel Program for the 2023 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM) that will be held June 28 to July 1, 2023, in Seattle, Washington. The AIM has, for over 25 years, been the world’s leading forum for scientific and engineering researchers from all over the world who share an interest in mechatronic systems and control theory and the applications of systems and control technology. The conference will feature the presentation of contributed and invited papers, tutorial sessions, as well as plenary and semi-plenary sessions and workshops.The IEEE/ASME AIM provides a unique opportunity for students to interact with members of the professional community in a stimulating setting and to exchange ideas with a broad group of colleagues. The large number of workshops and tutorial sessions during the conference and the interactive format of many of the presentations will allow additional opportunity for training and learning.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
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专著(0)
科研奖励(0)
会议论文
CAREER: Modeling and Control of Cellular Response to Dynamic Mechanical Manipulation Using a Dual-Input Platform
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批准号:1751503
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项目类别:Standard Grant
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资助金额:$50.0万
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财政年份:2018
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负责人:Juan Ren
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依托单位:
Control-Based Adaptive Characterization of Nano-scale Mechanical and Structural Properties of Biological Materials
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批准号:1634592
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项目类别:Standard Grant
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资助金额:$34.6万
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财政年份:2016
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负责人:Juan Ren
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依托单位:
海外基金