3D-conditioning of substrates for deposition of optical waveguides

分项目1研究通过柔性版印刷调节塑料薄膜的自由表面能。这种膜基片的调节对于研究组中光波导的后续应用的润湿控制是必要的。作为第一个资助期的延伸，未来将需要应变相容的调节结构，其允许通过热成型的方式三维地形成膜基底。为了提高集成密度，在这些空间衬底的基础上实现向三维光机电互连器件的过渡。本子项目的研究分为两个互补的科学问题。它们允许在合作中有针对性地实施三维基板。Suttmann工作组研究印刷板的光束功能化，以实现柔性版印刷过程中颜色转移的局部控制。与第一个供能期相比，不仅印模的非接触边缘区域被功能化，而且接触支承端面也被功能化。因此，需要通过增材和减材光束技术对表面进行抗压改性。Overmeyer工作组研究了如何将局部润湿控制用于应变兼容调节结构的印刷。光束功能化的印刷形式允许控制印刷区域以及转移的材料量。除此之外，灵活的调节材料，以及禁止在印刷布局的地区进行检查。这些互补印刷技术的特征在于它们对热成型工艺的适用性。作为子项目1中的生产过程的结果，研究小组获得了作为空间光学总线系统基础的经调节的三维电路载体。

The subproject 1 examines the conditioning of the free surface energy of plastic films by means of flexographic printing. This conditioning of the film substrates is necessary for the wetting control for the subsequent application of optical waveguides in the research group. As an extension to the first funding period, there will be a need in the future for strain-compatible conditioning structures which allow a three-dimensional forming of the film substrates by means of thermoforming. In order to increase the integration density, the transition to three-dimensional opto-mechatronic interconnect devices is realized on the basis of these spatial substrates.The research in the subproject is divided into two complementary scientific questions. They allow, in cooperation the targeted implementation of three-dimensional substrates. The Suttmann working group investigates the beam-functionalization of printing plates in order to achieve a local control of the color transfer in the flexographic printing process. In contrast to the first funding period, not only the non-contacting edge area of the stamp is functionalized but also the contact-bearing end face. For this reason, a pressure-resistant modification of the surface is required by means of additive and subtractive beam techniques.The Overmeyer working group investigates how a locally acting wetting control can be used for the printing of strain-compatible conditioning structures. The beam-functionalized printing forms allow control of the printing area as well as the transferred material quantities. In addition to this, flexible conditioning materials as well as keep-out areas in the printing layout are examined. These complementary printing techniques are characterized in terms of their suitability for the thermoforming process. As a result of the production processes in subproject 1, the research group is provided with conditioned three-dimensional circuit carriers as the basis for a spatial optical bus system.