3D-conditioning of substrates for deposition of optical waveguides

分项目1审查通过柔版印刷对塑料薄膜的自由表面能进行调节。薄膜衬底的这种调节对于随后在研究组中应用光波导时的润湿控制是必要的。作为第一个资助期的延长，未来将需要应变相容的调节结构，这种结构允许通过热成型的方式对薄膜衬底进行三维成型。为了提高集成密度，在这些空间衬底的基础上实现了向三维光机电互连器件的过渡。它们允许在合作中有针对性地实施三维衬底。Suttmann工作组研究了印版的光束功能化，以实现对柔版印刷过程中的色彩转移的局部控制。与第一个资助期相比，邮票不仅非接触式边缘区域功能化，而且接触式端面也功能化。为此，需要通过加法和减法光束技术对表面进行耐压改性。Overmeyer工作组研究如何将局部作用的润湿控制用于印刷应变兼容的调节结构。射束功能化打印表单允许控制打印区域以及转移的材料数量。除此之外，还检查了柔性调节材料以及印刷布局中的防护区。这些互补的印刷技术的特点是它们适合热成型工艺。作为子项目1中生产工艺的结果，研究组获得了有条件的三维电路载体，作为空间光总线系统的基础。

The subproject 1 examines the conditioning of the free surface energy of plastic films by means of flexographic printing. This conditioning of the film substrates is necessary for the wetting control for the subsequent application of optical waveguides in the research group. As an extension to the first funding period, there will be a need in the future for strain-compatible conditioning structures which allow a three-dimensional forming of the film substrates by means of thermoforming. In order to increase the integration density, the transition to three-dimensional opto-mechatronic interconnect devices is realized on the basis of these spatial substrates.The research in the subproject is divided into two complementary scientific questions. They allow, in cooperation the targeted implementation of three-dimensional substrates. The Suttmann working group investigates the beam-functionalization of printing plates in order to achieve a local control of the color transfer in the flexographic printing process. In contrast to the first funding period, not only the non-contacting edge area of the stamp is functionalized but also the contact-bearing end face. For this reason, a pressure-resistant modification of the surface is required by means of additive and subtractive beam techniques.The Overmeyer working group investigates how a locally acting wetting control can be used for the printing of strain-compatible conditioning structures. The beam-functionalized printing forms allow control of the printing area as well as the transferred material quantities. In addition to this, flexible conditioning materials as well as keep-out areas in the printing layout are examined. These complementary printing techniques are characterized in terms of their suitability for the thermoforming process. As a result of the production processes in subproject 1, the research group is provided with conditioned three-dimensional circuit carriers as the basis for a spatial optical bus system.