SBIR Phase I: The Next Generation of High-Speed Dielectric Materials

SBIR 第一阶段：下一代高速介电材料

• 批准号: 2322075
• 负责人: Tristan Ossama El Bouayadi
• 金额: $ 27.28万
• 依托单位: THINTRONICS INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-10-01 至 2024-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2322075&HistoricalAwards=false
• 关键词: SBIR; Phase; Next; Generation; Speed

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase I project centers on developing a high-speed, high-performance insulator platform for Printed Circuit Boards (PCBs) that will significantly enhance performance in networking, communications, and computing. While PCB manufacturing has seen significant advances, innovation in insulator technology has been lacking for two decades. This gap has led to suboptimal performance in signal integrity, data rates, efficiency, heat generation, form factor, and cost. Such limitations can be overcome by replacing fiber-reinforced laminates with non-reinforced, low loss materials. By developing a novel class of insulating materials, the project will enable faster processing speeds and higher data rates to facilitate the development of next generation electronics. This project aims to work with US-based PCB manufacturers to de-risk supply chain bottlenecks and on-shore manufacturing jobs.This Small Business Innovation Research Phase I project aims to develop novel, synthetic polymer alternatives to current fiber-reinforced materials for printed circuit boards (PCBs) that are skew-free with a low dielectric constant (Dk) and low dissipation factor (DF). PCBs are paramount for all electronics but result in high signal loss due to the anisotropy of the fiber-reinforced laminate materials traditionally used. As demand for higher data rate rises, skew-free, ultra-low loss, and low Dk materials are needed. Current dielectric materials have non-uniform dielectric properties, so transmission lines encounter a different effective Dk, causing skew and limiting data rates. By developing synthetic polymer films as an alternative to traditional PCB dielectric materials, the team aims to develop low Dk (≤ 2.8) and low DF (≤ 0.0026) materials that are inherently skew-free and low loss. Novel thermosetting polymer formulations must be developed and characterized. Successful evaluation of materials with properties conducive to PCBs can then be taken through pilot manufacturing to determine their viability in large-scale manufacturing environments. Finally, these low Dk, low DF materials can be used to create prototype PCBs to evaluate their reliability before generating more complex PCB structures required for high-density-interconnect-type applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该小型企业创新研究（SBIR）第一阶段项目的更广泛/商业影响集中在为印刷电路板（PCB）开发高速，高性能绝缘体平台，这将显着提高网络，通信和计算的性能。虽然PCB制造已经取得了重大进展，但绝缘体技术的创新已经缺乏了二十年。这一差距导致了信号完整性、数据速率、效率、发热、外形尺寸和成本方面的次优性能。这种限制可以通过用非增强的低损耗材料代替纤维增强层压板来克服。通过开发新型绝缘材料，该项目将实现更快的处理速度和更高的数据速率，以促进下一代电子产品的开发。该项目旨在与美国的PCB制造商合作，降低供应链瓶颈风险，减少在岸制造工作岗位。该小企业创新研究第一阶段项目旨在开发新型合成聚合物替代品，以取代目前用于印刷电路板（PCB）的纤维增强材料，该材料具有无偏斜、低介电常数（Dk）和低耗散因数（DF）。PCB对于所有电子产品都是至关重要的，但由于传统上使用的纤维增强层压材料的各向异性，导致高信号损耗。随着对更高数据速率的需求上升，需要无偏斜、超低损耗和低Dk材料。目前的电介质材料具有不均匀的介电特性，因此传输线会遇到不同的有效Dk，从而导致偏斜并限制数据速率。通过开发合成聚合物薄膜作为传统PCB介电材料的替代品，该团队的目标是开发低Dk（≤ 2.8）和低DF（≤ 0.0026）材料，这些材料具有固有的无偏斜和低损耗。必须开发和表征新型热固性聚合物配方。然后，可以通过试生产来成功评估具有有利于多氯联苯特性的材料，以确定其在大规模生产环境中的可行性。最后，这些低Dk、低DF材料可用于制造PCB原型，在制造高密度互连类型应用所需的更复杂PCB结构之前评估其可靠性。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。