Manufacturing of stepped micro components with insert parts via galvanic deposition in microstructured two-component polymer templates

通过微结构双组分聚合物模板中的电沉积制造带有插入部件的阶梯式微组件

• 批准号: 261189330
• 负责人: Dr.-Ing. Volker Piotter
• 金额: --
• 依托单位: Institut für Angewandte Materialien - Werkstoffkunde (IAM-WK)
• 依托单位国家: 德国
• 项目类别: Research Grants (Transfer Project)
• 财政年份: 2014
• 资助国家: 德国
• 起止时间: 2013-12-31 至 2019-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/261189330?language=en
• 关键词: Manufacturing; stepped; micro; components; insert

The main objective of this project is the transfer of Know How gained in the Forschergruppe 702 into an industrial application. In this frame a galvanoforming process suitable for stepped micro components which additionally contain at least one ceramic insert part has to be developed. Materials will be stainless steel 304L and nickel or nickel-alloys. For this purpose the process technology has to be enhanced accordingly. One important innovation will be the utilization of 2C-templates with incorporated conductive foils to achieve a stepwise electroplating procedure. Basic trials with respect to microstructure and grain size in dependance of parameters, starting layers, carbon diffusion between templates and steel bodies and metal deposition rate as a function of the current density distribution have to be investigated.

该项目的主要目标是将702研究小组获得的技术转移到工业应用中。在此框架中，必须开发适合于另外包含至少一个陶瓷插入件的阶梯式微型部件的电铸工艺。材料为不锈钢304 L和镍或镍合金。为此，必须相应地提高工艺技术。一个重要的创新将是利用2C-模板与纳入导电箔，以实现逐步电镀程序。必须研究与参数、起始层、模板和钢体之间的碳扩散以及作为电流密度分布的函数的金属沉积速率相关的微观结构和晶粒尺寸的基本试验。

项目成果

Development of stacked conductive templates for electroforming of multi-level metallic micro components

用于多层金属微元件电铸的堆叠导电模板的开发

• DOI: 10.1007/s00542-019-04699-3
• 发表时间: 2019
• 期刊: Microsystem Technologies
• 作者: Piotter;Guttmann;Winkler
• 通讯作者: Winkler