Investigation of intermetallic compound formation,Kirkendall void nucleation and failure in solder joints

研究金属间化合物的形成、柯肯达尔空洞成核和焊点失效

基本信息

批准号：
265705691
负责人：
Professorin Dr.-Ing. Kerstin Weinberg
金额：
--
依托单位：
Department Maschinenbau
依托单位国家：
德国
项目类别：
Research Grants
财政年份：
2015
资助国家：
德国
起止时间：
2014-12-31 至 2020-12-31
项目状态：
已结题

来源：
https://gepris.dfg.de/gepris/projekt/265705691?language=en
关键词：
Investigation intermetallic compound formation Kirkendall

项目摘要

Microelectronic circuits units include several connections, in particular solder joints between different metal layers which hold the multi-layered unit in position. Aging of the solder alloy, formation of intermetallics (IMCs) along the electrodes as well as nucleation and growth of pores and cracks influence the properties of the joints and may significantly affect the life expectation of the whole circuit unit. Though this topic is of high practical relevance, by today most investigations of IMC growth in solder are observantly, preditive models for IMC growth, void nucleation and crack formation are not available. The goal of the proposed research project is to provide a numerical tool for simulations of intermetallic growth and long-term aging in solder-copper connections. To this end we will derive a coupled phase-field model of the solder's microstructure subjected to thermal, mechanical and electrical loading. The nucleation of Kirkendall voids, their subsequent growth to pores and the formation of cracks under the influence of typical loadings will be in the center of attention. Regarding the available experimental and thermodynamical data we plan to model pure Sn-solder balls and traditional eutectic Sn-Pb solder on copper pads. Both solder connections have two distinct IMCs, Cu6Sn5 in the bulk and along the interfaces and Cu3Sn along the copper pad. In conclusion, the project will lead to fully three-dimensional simulations of the system solder-ball-on-copper-pad which allow for predictions of phase decomposition, IMC growth, void nucleation and crack propagation in real world applications.

微电子电路单元包括几个连接，特别是在不同金属层之间将多层单元保持在适当位置的焊接接头。焊料合金的衰老，沿电极沿电极间金属形成（IMC）的形成以及孔和裂纹的成核和生长会影响关节的性质，并可能显着影响整个电路单元的寿命预期。尽管该主题具有很高的实际相关性，但如今，大多数对焊料中IMC增长的研究都很明显，但尚未获得IMC增长，无效成核和裂纹形成的预先模型。拟议的研究项目的目的是为焊接 - 波波连接中金属间增长和长期老化的模拟提供数值工具。为此，我们将得出受热，机械和电气负载约束的焊料微结构的耦合相位模型。 Kirkendall空隙的成核，随后的毛孔生长以及在典型载荷影响下的裂纹形成将是关注的中心。关于可用的实验和热力学数据，我们计划在铜垫上对纯SN持有球和传统的Eutectic SN-PB焊料进行建模。两种焊料连接都有两个不同的IMC，散装中的Cu6SN5以及沿铜垫的界面和Cu3SN。总之，该项目将导致对系统焊接系统焊接系统的完全三维模拟，从而可以预测现实世界应用中相位分解，IMC增长，无效核定和裂纹繁殖的预测。