Study on high quality micro-joining of glass and semiconductors by picosecond pulsed laser

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Picosecond pulsed laser can provide a reliable technique for fusion welding of glass and semiconductor material, which have been widely used in microelectromechanical systems (MEMS) packaging applications. For achieving stable joining of glass and semiconductor material by picosecond pulsed laser, both simulation and experiment were carried out. In the simulation part, the variation of free-electron density under different focusing situations was numerically calculated to discuss the characteristics of molten area in glass welding process. In the experiment part, a liquid crystal on silicon-spatial light modulator (LCOS-SLM) was installed, since LCOS-SLM can control the laser intensity distribution efficiently. This research work has been conducted smoothly according to the research plan.