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Study on high quality micro-joining of glass and semiconductors by picosecond pulsed laser

皮秒脉冲激光玻璃与半导体高质量微连接研究

基本信息

批准号：
21J13688
负责人：
OUYANG Zhiyong
金额：
$ 0.96万
依托单位：
Okayama University
依托单位国家：
日本
项目类别：
Grant-in-Aid for JSPS Fellows
财政年份：
2021
资助国家：
日本
起止时间：
2021-04-28 至 2023-03-31
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-21J13688/
关键词：
Picosecond pulsed laser Glass material Semiconductor material Micro-welding

项目摘要

Picosecond pulsed laser can provide a reliable technique for fusion welding of glass and semiconductor material, which have been widely used in microelectromechanical systems (MEMS) packaging applications. For achieving stable joining of glass and semiconductor material by picosecond pulsed laser, both simulation and experiment were carried out. In the simulation part, the variation of free-electron density under different focusing situations was numerically calculated to discuss the characteristics of molten area in glass welding process. In the experiment part, a liquid crystal on silicon-spatial light modulator (LCOS-SLM) was installed, since LCOS-SLM can control the laser intensity distribution efficiently. This research work has been conducted smoothly according to the research plan.

皮秒脉冲激光为玻璃和半导体材料的熔焊提供了可靠的技术，在微机电系统（MEMS）封装中得到了广泛的应用。为了实现皮秒脉冲激光对玻璃和半导体材料的稳定连接，进行了模拟和实验研究。仿真部分对不同聚焦情况下自由电子密度的变化进行了数值计算，探讨了玻璃焊接过程中熔区特性。在实验部分，由于液晶硅-空间光调制器（LCOS-SLM）可以有效地控制激光强度分布，因此安装了液晶硅-空间光调制器。本次研究工作按照研究计划顺利进行。