Development of thermoplastic-compatible piezoceramic modules (TPM) and corresponding production processes (A05)

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Aim of subproject A05 is the systematic development and technological implementation of thermoplastic-compatible piezoceramic modules (TPM), whose functionalized thermoplastic carrier film is already matched to the matrix material of carbon or glass fiber reinforced thermoplastic composite structure to be integrated in. Due to defined melting of the thermoplastic matrix component it is thus possible to generate a homogeneous connection between function module and composite structure within in the manufacturing process of thermoplastic composite structure, whereby the adhesive bonding assembly step is omitted.