Development of thermoplastic-compatible piezoceramic modules (TPM) and corresponding production processes (A05)

A05子项目的目标是热塑性兼容压电陶瓷模块(TPM)的系统开发和技术实施，其功能化的热塑性载体膜已与待集成的碳纤维或玻璃纤维增强热塑性复合材料结构的母材匹配。由于热塑性基质组分的限定熔化，因此在热塑性复合结构的制造过程中，可以在功能模块和内部的复合结构之间产生均匀的连接，由此省略了粘接组装步骤。

Aim of subproject A05 is the systematic development and technological implementation of thermoplastic-compatible piezoceramic modules (TPM), whose functionalized thermoplastic carrier film is already matched to the matrix material of carbon or glass fiber reinforced thermoplastic composite structure to be integrated in. Due to defined melting of the thermoplastic matrix component it is thus possible to generate a homogeneous connection between function module and composite structure within in the manufacturing process of thermoplastic composite structure, whereby the adhesive bonding assembly step is omitted.