Technology for an adapitve optical bus-coupling on three-dimensional structures

三维结构自适应光总线耦合技术

• 批准号: 394521287
• 负责人: Professor Dr.-Ing. Karlheinz Bock
• 金额: --
• 依托单位: Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT)
• 依托单位国家: 德国
• 项目类别: Research Units
• 财政年份: 2018
• 资助国家: 德国
• 起止时间: 2017-12-31 至 2021-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/394521287?language=en
• 关键词: Technology; adapitve; optical; bus; coupling

Regarding the rapidly increasing device communication (buzzword: internet of things, industry 4.0) there is a high demand for fast and high-efficient data links. Due to that, the data rates increase which pushes standard electrical connections to their limits. Especially regarding the bandwidth-energy-efficiency and the required space, optical short range connections are a promising alternative. However, it is necessary to find solutions for the realization of optical bus-systems in three-dimensional environments. During the first funding period the approach of an asymmetric optical bus-coupler (AOBC) was developed and proofed for the use in optical data communication scenarios. The AOBC enables for a bidirectional, interruption-free bus-coupling in 2D. In the second funding period, the initial goal is the enrichment of the current level of knowledge in the field of the directional bus-coupling. According to that, the effects during the coupling process shall be understood, especially with the use of printed polymer waveguides. That includes index changing under pressure, higher coupling rates due to a micro roughness and a selective structuring of the surfaces of the coupling partners. With the results of these studies, the intension is to investigate solutions to couple electro-optical devices to an optical bus on a three-dimensional surface. In this context, robust coupling efficiencies are to be obtained regardless the curvature of the surface the device is connected on. At the same time it is essential to achieve SMT-compatibility of the coupling technology to be able to use matured mounting technologies (e.g. Flip-Chip). According to that, the competitiveness of optical technologies shall be increased compared to their electrical pendants.

快速增长的设备通信（流行语：物联网，工业4.0）对快速高效的数据链路有很高的需求。因此，数据速率增加，将标准电气连接推向其极限。特别是考虑到带宽能量效率和所需空间，光短距离连接是一种很有前途的选择。然而，如何在三维环境中实现光学总线系统，仍是一个亟待解决的问题。在第一个资助期内，非对称光总线耦合器（AOBC）的方法被开发并验证用于光数据通信场景。AOBC支持二维的双向、无中断的总线耦合。在第二个资助期，初始目标是丰富当前定向总线耦合领域的知识水平。根据这一点，耦合过程中的影响应该被理解，特别是使用印刷聚合物波导。这包括压力下的指数变化，由于微粗糙度和耦合伙伴表面的选择性结构而导致的更高的耦合率。根据这些研究结果，重点是研究在三维表面上将光电器件耦合到光学总线的解决方案。在这种情况下，无论设备连接的表面曲率如何，都要获得稳健的耦合效率。同时，为了能够使用成熟的安装技术（例如Flip-Chip），实现耦合技术的smt兼容性至关重要。因此，光学技术的竞争力要比电子技术更强。