Analysis and modelling of microscale surface structuring through lapping (A09)

研磨过程中的表面形貌是研磨颗粒运动学、研磨液和材料去除机构之间复杂相互作用的结果。这些相互作用将通过实验和数值映射进行研究。首先建立了材料去除的物理模型和角粒运动学基本模型以及窄缝内流体流动的基本模型，最后耦合到整体研磨过程模型。利用研磨模拟，可以确定零件表面定向微结构的参数组合，并可以分析交互作用。

The surface morphology during lapping results from complex interactions between the lapping grain kinematics, the influence of the lapping fluid and the material removal mechanism. These interactions are to be investigated experimentally and mapped numerically. First, a physical material removal model as well as basic models of the kinematics of angular grains and the fluid flow in narrow gaps will be developed, which finally will be coupled to a holistic lapping process model. Using the lapping simulation, parameter combinations for targeted microstructuring of the component surface can be determined and interactions can be analyzed.