Analysis and modelling of microscale surface structuring through lapping (A09)

通过研磨对微尺度表面结构进行分析和建模 (A09)

• 批准号: 399777748
• 金额: --
• 依托单位: Lehrstuhl für Computational Physics in Engineering (CPE)
• 依托单位国家: 德国
• 项目类别: Collaborative Research Centres
• 财政年份: 2018
• 资助国家: 德国
• 起止时间: 2017-12-31 至 2022-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/399777748?language=en
• 关键词: Analysis; modelling; microscale; surface; structuring

The surface morphology during lapping results from complex interactions between the lapping grain kinematics, the influence of the lapping fluid and the material removal mechanism. These interactions are to be investigated experimentally and mapped numerically. First, a physical material removal model as well as basic models of the kinematics of angular grains and the fluid flow in narrow gaps will be developed, which finally will be coupled to a holistic lapping process model. Using the lapping simulation, parameter combinations for targeted microstructuring of the component surface can be determined and interactions can be analyzed.

研磨过程中的表面形貌是研磨颗粒运动、研磨流体的影响和材料去除机制的复杂相互作用的结果。这些相互作用将进行实验研究和数值映射。首先，建立物理材料去除模型以及角颗粒运动学和窄间隙流体流动的基本模型，最后将其耦合到整体研磨过程模型。通过研磨模拟，可以确定零件表面目标微结构的参数组合，并分析相互作用。