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Development of High Performance Copper-base Shape Memory Alloys by means of Rapid Solidification.

利用快速凝固技术开发高性能铜基形状记忆合金。

基本信息

批准号：
60850133
负责人：
MURAKAMI Yotaro
金额：
$ 6.08万
依托单位：
Faculty of Engineering, Kansai University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Developmental Scientific Research
财政年份：
1985
资助国家：
日本
起止时间：
1985 至 1986
项目状态：
已结题

项目摘要

Although Cu-base shape memory alloys (SMA) have the large potential to be used as new functional materials owing to a lower price compared with that of the Ni-Ti SMA, the application seems to be limited by the reason that ordinary polycrystalline materials have a rather low ductility in case of a coarse grain structure, which may be an inherent property of these alloy systems.The present investigation has been carried out to improve a ductility in Cu-Al-Ni-Mn SMA by grain refinement using a rapid solidification techniques combined with powder metallurgy(P/M) method. At the same time, it has been also made to develope the technological method of controlling transformation temperatures of SMA by P/M method, which consists of mixing the two kinds of standerd alloys with the definite transformation temperature.It was found that the addition of 1% Ti and 0.2%V to 4032III alloy developed by the research group of Kansai University was most effective to obtain the small grain size such as 3-4 <mu> m even after annealing for 30 min at 900゜C in the specimen prepared by RSP-P/M. These specimens showed a fairly improved hot and cold deformability together with a good SM effect. However, the transformation temperatures were found to be affected considerably due to the grain size with the order of several micron metres as well as the fine distribution of the compounds, which plays an important role for restriction to grain growth during annearing. The method of controlling the transformation temperatures of SAM has been established by RSP-P/M using the two previously prepared RSP, which has the difinit transformation temperature. These specimen showed to have agood ductility by SEM fractograpy.

铜基形状记忆合金(SMA)由于价格低于Ni-Ti形状记忆合金，具有很大的应用潜力，但由于普通多晶材料的粗晶组织延展性较低，这可能是这些合金系统的固有特性，因此限制了其应用。同时，还提出了用粉末冶金方法控制形状记忆合金相变温度的工艺方法，即将两种标准合金按一定的相变温度混合。结果表明，关西大学课题组研制的4032III合金中添加1%的钛和0.2%的钒，即使在900゜℃下退火30分钟，也能获得3-4&lt；Mu&gt；m等细小的晶粒度，具有较好的冷热变形能力和良好的形状记忆效果。然而，相变温度受几个微米量级的晶粒尺寸和化合物的细小分布的影响很大，这对限制退火过程中的晶粒长大起到了重要作用。利用RSP-P/M建立了控制SAM相变温度的方法，利用预先制备的两种RSP确定了相变温度。扫描电子显微镜断口分析表明，这些试件具有良好的延展性。