Development of High Performance Copper-base Shape Memory Alloys by means of Rapid Solidification.

利用快速凝固技术开发高性能铜基形状记忆合金。

基本信息

批准号：
60850133
负责人：
MURAKAMI Yotaro
金额：
$ 6.08万
依托单位：
Faculty of Engineering, Kansai University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Developmental Scientific Research
财政年份：
1985
资助国家：
日本
起止时间：
1985 至 1986
项目状态：
已结题

项目摘要

Although Cu-base shape memory alloys (SMA) have the large potential to be used as new functional materials owing to a lower price compared with that of the Ni-Ti SMA, the application seems to be limited by the reason that ordinary polycrystalline materials have a rather low ductility in case of a coarse grain structure, which may be an inherent property of these alloy systems.The present investigation has been carried out to improve a ductility in Cu-Al-Ni-Mn SMA by grain refinement using a rapid solidification techniques combined with powder metallurgy(P/M) method. At the same time, it has been also made to develope the technological method of controlling transformation temperatures of SMA by P/M method, which consists of mixing the two kinds of standerd alloys with the definite transformation temperature.It was found that the addition of 1% Ti and 0.2%V to 4032III alloy developed by the research group of Kansai University was most effective to obtain the small grain size such as 3-4 <mu> m even after annealing for 30 min at 900゜C in the specimen prepared by RSP-P/M. These specimens showed a fairly improved hot and cold deformability together with a good SM effect. However, the transformation temperatures were found to be affected considerably due to the grain size with the order of several micron metres as well as the fine distribution of the compounds, which plays an important role for restriction to grain growth during annearing. The method of controlling the transformation temperatures of SAM has been established by RSP-P/M using the two previously prepared RSP, which has the difinit transformation temperature. These specimen showed to have agood ductility by SEM fractograpy.

尽管与Ni-Ti SMA相比，Cu碱形状的记忆合金（SMA）具有较大的新功能材料的可能性，但与Ni-Ti SMA相比，该应用似乎受到普通多晶材料的限制，因为普通的多晶材料具有相当低的耐耐性，因此，在晶粒结构中，晶粒结构可能是这些合成系统的属性，并且可以改善这些合同的属性。使用快速凝固技术结合粉末冶金（P/M）方法的细化。同时，也已经提出了通过p/m方法来开发控制SMA转换温度的技术方法，包括将两种常规合金与定义的转换温度混合在一起。发现添加1％Ti和0.2％V到4032ii Alloy的添加到4032ii Alloy是由Smill of Kansai gress Interial greation sy My y My y Mane <30 <30 gyer的30 <30 <30的<More gress <3-3-由RSP-P/m制备的样品中的900 c。这些标本显示出相当改善的热和冷可变形性以及良好的SM效果。然而，由于晶粒尺寸为几微米米，并且化合物的良好分布，发现转化温度受到仔细影响，这对于限制了在每年期间对晶粒生长的限制起着重要作用。 RSP-P/M使用两个先前准备的RSP建立了控制SAM转化温度的方法，该RSP具有差异转换温度。这些标本表明通过SEM骨造影表现为以前的延展性。