Preparation of Corrosion-Resistant Amorphous Surface Alloys

为了通过溅射在传统的晶体基底金属上制备耐腐蚀的非晶表面合金，进行了合作研究，以澄清腐蚀性溶液泄漏到基底金属从而对基底金属进行腐蚀攻击的溅射沉积物缺陷形成的起源，并建立无缺陷溅射沉积物形成的条件。(1)将DC磁控溅射机安装在洁净室中，以避免外来物质粘附到基板上以及溅射真空室被外来物质污染。靶材和衬底的表面处理必须在洁净室中进行。(2)将真空室预先抽真空。99.999%纯氩气通过过滤器以除去灰尘、H_2O和O_2。将如此纯化的高纯度氩气用于溅射。(3)为了避免在表面合金中形成缺陷， ...更多信息 在杂质方面，由金属板镶嵌或放置合金元素组成的非均质靶比烧结合金靶更好。当使用异质靶时，通过连续改变衬底相对于靶的位置，可以避免溅射表面合金的区域成分异质性。(4)溅射氩气的高压除了使表面合金被氩气污染之外，还降低了表面合金与基底金属之间的粘附，而溅射氩气的低压由于表面合金的压应力的增加而导致表面合金从基底金属剥离的趋势增加。因此，溅射必须在适当的氩气压力下进行，例如约10 μ <-4>l。(5)基材的微观不均匀性会导致形成有缺陷的表面合金，因此必须使用微观均匀的基材。为此，通过抛光或电抛光对基底表面进行镜面精加工是有用的。少

In order to prepare corrosion-resistant amorphous surface alloys on conventional crystalline substrate metals by sputtering, collaborative studies were performed to clarify the origin of formation of defects of sputter-deposits through which corrosive solutions leak to the substrate metals with a consequent corrosive attack of the substrate metals, and to establish the conditions for the formation of defect-free sputter deposits.(1) A DC magnetron sputtering machine was installed in a clean room in order to avoid adherence of foreign substances to the substrate and contamination of the sputtering vacuum chamber with foreign substances. Surface finishing of the target and substrate must be done in the clean room.(2) The vacuum chamber was pre-evacuated sufficientyl. The 99.999% pure argon gas was passed through filters for removal of dust, H_2O and O_2. The high purity argon gas thus purified was used for sputtering.(3) In order to avoid the formation of defects in the surface alloys du … More e to impurities, the heterogeneous target consisting of a metel plate on which alloying elements were embedded or placed was rather better than the sintered alloy target. When the heterogeneous target was used, regional compositional hetero-geneity of the sputtered surface alloy was avoidable by continuous change in the position of the sub-strate relative to the target.(4) The high pressure of the sputtering argon gas decreases the adhesiveness between the surface alloy and the substrate metal in addition to contamination of the surface alloy with argon gas, while the low pressure of the sputtering argon gas results in increase in the tendency of exfoliation of the surface alloy from the substrate metal due to an increase in the compressive stress of the surface alloy. Therefore, sputtering must be done under adequate pressures of argon gas such as about 10^<-4> torr.(5) Microscopic unevenness of the substrate gives rise to the formation of defective surface alloys, and hence microscopically even substrate must be used. For the purpose mirror-like finishing of the sub-strate surface by buffing or electrtopolishing was useful. Less