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Development of ultra high strengh gold alloy for adhesion bridege

Development of ultra high strengh gold alloy for adhesion bridege
粘接桥用超高强度金合金的研制
批准号:
61870080
负责人:
NAKAMURA Kengo
金额:
$10.5万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Developmental Scientific Research
财政年份:
1986
资助国家:
日本
项目状态:
已结题
起止时间:
1986 至 1987

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项目成果

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中文摘要
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英文摘要
In 1986, sixteen kinds of Au-Pt-Cu-Ag alloys (PTG), containing 70 part of Au+Pt, 30 part of Cu+Ag, 2 part of Zn as a deoxidizer and 0.05 part of Ir as a grain refiner were melted in pure argon atomosphere. Test specimens were made from these alloy ingots using dental precision casting, and the mecanical properties after quenching (softning) and hardening heat treatment were measured. After the hardening heat treatment, tensile strength, elongation, and Vickers hardness of 65Au-5Pt-20Cu-15Ag (PTG-3) and 60Au-10Pt-15Cu-15Ag (PTG-6) alloy were over 95kgf/mm^2, over 2% and over 300, respectively. These two alloys were most optimum among the 16 tested alloys. In addition to these tests, mechanical properties for twelve kinds of Ag-Pd-Cu ternary alloys (AP), containing 25-40wt% Pd, 15-25wt% Cu, were also mesured using the method described above. The 35Pd-20Cu-45Ag ternary alloy had maximum tensile strength after hardening heat treatment. A 10% Au was added to the alloys close to this composi … More tion and their mechanical properties were also measured. 10Au-30Pd-20Cu-40Ag (APG-7) and 10Au-30Pd-25Cu-35Ag (APG-11) were suitable for adhesion bridges from the view of their tensile strength and Vicker's hardness that were 101kgf/mm^2, 343 and 104kgf/mm^2, 358, respectively.In 1987, a method for bond strength was newly developed using two small test pieces(10 , 6h). This method enabled to measure four types of bond strength(sher bond strength by compression loading,tensile bond strength, bending bond strength and torsional shear bond strength). The shear bond strength by compression loading and tensile bond strength were measured for the aforementioned 4 alloys (PTG-3, PTG-6, APG-7, APG-11) with 4META system adhesives (Superbond C&B, SB C&B) and phosphoric ester system adhesives (Panavia EX, PEX). When PEX was used, for all types of alloys, the bond strength on the polished surface was small, however, the bond strength of 400-500kgf/cm^2 was shown on the oxidized surface that was created by the hardening heat tereatment, and on the tin-plated surface. When SB C&B was used, every alloys adhered well with all surfaces, polished, oxidized, and tin-plated surfaces, and their bond strength were over 400kgf/cm^2. It is concluded that if appropriate surface treatment is carried out on precious alloys such as platinum added gold alloys (PTG) and gold-silver-palladium alloys (APG), the shear bond strength by compression loading and tensile bond strength are more than 600kgf/cm^2. Less
期刊论文(10)
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科研奖励(0)
会议论文
中村健吾,小倉英夫,後藤真一: 歯科材料・器械(特別号). 6. (1987)
Kengo Nakamura、Hideo Ogura、Shinichi Goto:牙科材料和仪器(特刊)6。(1987)。
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发表时间:
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通讯作者:
Kengo, NAKAMURA: "Properties of casting Au-Pt-Cu-Ag alloys" J J Dent Mat. 6. 54-55 (1987)
Kengo, NAKAMURA:“铸造 Au-Pt-Cu-Ag 合金的特性”J J Dent Mat。
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通讯作者:
Toshikuni, OKA: "New Type Adehesion Testing Apparatus" Adhes Dent. 6. 69-70 (1988)
Toshikuni, OKA:“新型粘合力测试装置”粘合凹痕。
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作者: []
通讯作者:
中村健吾: 歯科材料・器械. 6. 54-55 (1987)
Kengo Nakamura:牙科材料和仪器。6. 54-55 (1987)
DOI: --
发表时间:
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影响因子: --
作者: []
通讯作者:
Study of Bonding Fatigue Strength by Dental Adhensive Resin
  • 批准号:
    05404068
  • 项目类别:
    Grant-in-Aid for General Scientific Research (A)
  • 资助金额:
    $7.23万
  • 财政年份:
    1993
  • 负责人:
    NAKAMURA Kengo
  • 依托单位:
海外基金