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Development of ultra high strengh gold alloy for adhesion bridege

Development of ultra high strengh gold alloy for adhesion bridege
粘接桥用超高强度金合金的研制
批准号:
61870080
负责人:
NAKAMURA Kengo
金额:
$10.5万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Developmental Scientific Research
财政年份:
1986
资助国家:
日本
项目状态:
已结题
起止时间:
1986 至 1987

项目摘要

项目成果

NAKAMURA Kengo的其他基金

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中文摘要
翻译
1986年,在纯氩气氛中熔炼了16种Au-Pt-Cu-Ag合金(PTG),其中含70份Au+Pt,30份Cu+Ag,2份Zn作脱氧剂,0.05份Ir作晶粒细化剂。用牙科精密铸造法制备了合金铸锭,并测定了淬火(软化)和硬化热处理后的力学性能。65 Au-5 Pt-20 Cu-15 Ag(PTG-3)和60 Au-10 Pt-15 Cu-15 Ag(PTG-6)合金经淬火热处理后,抗拉强度、延伸率和维氏硬度分别大于95 kgf/mm^2、2%和300。这两种合金是16种试验合金中最佳的。除此之外,还用上述方法测定了12种含25- 40wt%Pd,15- 25wt%Cu的Ag-Pd-Cu三元合金(AP)的力学性能。35 Pd-20 Cu-45 Ag三元合金在硬化热处理后具有最大的抗拉强度。在合金中加入10%的Au, ...更多信息 并测定了它们的力学性能。10Au-30 Pd-20 Cu-40 Ag(APG-7)和10Au-30 Pd-25 Cu-35 Ag(APG-11)的抗拉强度和维氏硬度分别为101 kgf/mm^2,343和104 kgf/mm^2,358,适合于粘接桥。该方法能够测量四种类型的粘结强度(通过压缩载荷的剪切粘结强度、拉伸粘结强度、弯曲粘结强度和扭转剪切粘结强度)。测量了上述4种合金(PTG-3、PTG-6、APG-7、APG-11)与4 META体系粘合剂(Superbond C&B、SB C&B)和磷酸酯体系粘合剂(Panavia EX、PEX)的压缩载荷剪切粘合强度和拉伸粘合强度。当使用PEX时,对于所有类型的合金,抛光表面的结合强度都很小,但是,在硬化热处理产生的氧化表面和镀锡表面上显示出400- 500 kgf/cm ^2的结合强度。当使用SB C&B时,每种合金与所有表面、抛光表面、氧化表面和镀锡表面均具有良好的结合,其结合强度超过400 kgf/cm ^2。结果表明,对铂金合金(PTG)和金银钯合金(APG)等贵金属合金进行适当的表面处理,其压剪结合强度和拉伸结合强度均大于600 kgf/cm ^2。少
英文摘要
In 1986, sixteen kinds of Au-Pt-Cu-Ag alloys (PTG), containing 70 part of Au+Pt, 30 part of Cu+Ag, 2 part of Zn as a deoxidizer and 0.05 part of Ir as a grain refiner were melted in pure argon atomosphere. Test specimens were made from these alloy ingots using dental precision casting, and the mecanical properties after quenching (softning) and hardening heat treatment were measured. After the hardening heat treatment, tensile strength, elongation, and Vickers hardness of 65Au-5Pt-20Cu-15Ag (PTG-3) and 60Au-10Pt-15Cu-15Ag (PTG-6) alloy were over 95kgf/mm^2, over 2% and over 300, respectively. These two alloys were most optimum among the 16 tested alloys. In addition to these tests, mechanical properties for twelve kinds of Ag-Pd-Cu ternary alloys (AP), containing 25-40wt% Pd, 15-25wt% Cu, were also mesured using the method described above. The 35Pd-20Cu-45Ag ternary alloy had maximum tensile strength after hardening heat treatment. A 10% Au was added to the alloys close to this composi … More tion and their mechanical properties were also measured. 10Au-30Pd-20Cu-40Ag (APG-7) and 10Au-30Pd-25Cu-35Ag (APG-11) were suitable for adhesion bridges from the view of their tensile strength and Vicker's hardness that were 101kgf/mm^2, 343 and 104kgf/mm^2, 358, respectively.In 1987, a method for bond strength was newly developed using two small test pieces(10 , 6h). This method enabled to measure four types of bond strength(sher bond strength by compression loading,tensile bond strength, bending bond strength and torsional shear bond strength). The shear bond strength by compression loading and tensile bond strength were measured for the aforementioned 4 alloys (PTG-3, PTG-6, APG-7, APG-11) with 4META system adhesives (Superbond C&B, SB C&B) and phosphoric ester system adhesives (Panavia EX, PEX). When PEX was used, for all types of alloys, the bond strength on the polished surface was small, however, the bond strength of 400-500kgf/cm^2 was shown on the oxidized surface that was created by the hardening heat tereatment, and on the tin-plated surface. When SB C&B was used, every alloys adhered well with all surfaces, polished, oxidized, and tin-plated surfaces, and their bond strength were over 400kgf/cm^2. It is concluded that if appropriate surface treatment is carried out on precious alloys such as platinum added gold alloys (PTG) and gold-silver-palladium alloys (APG), the shear bond strength by compression loading and tensile bond strength are more than 600kgf/cm^2. Less
期刊论文(10)
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科研奖励(0)
会议论文
中村健吾,小倉英夫,後藤真一: 歯科材料・器械(特別号). 6. (1987)
Kengo Nakamura、Hideo Ogura、Shinichi Goto:牙科材料和仪器(特刊)6。(1987)。
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通讯作者:
Kengo, NAKAMURA: "Properties of casting Au-Pt-Cu-Ag alloys" J J Dent Mat. 6. 54-55 (1987)
Kengo, NAKAMURA:“铸造 Au-Pt-Cu-Ag 合金的特性”J J Dent Mat。
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通讯作者:
Toshikuni, OKA: "New Type Adehesion Testing Apparatus" Adhes Dent. 6. 69-70 (1988)
Toshikuni, OKA:“新型粘合力测试装置”粘合凹痕。
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通讯作者:
中村健吾: 歯科材料・器械. 6. 54-55 (1987)
Kengo Nakamura:牙科材料和仪器。6. 54-55 (1987)
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通讯作者:
Study of Bonding Fatigue Strength by Dental Adhensive Resin
  • 批准号:
    05404068
  • 项目类别:
    Grant-in-Aid for General Scientific Research (A)
  • 资助金额:
    $7.23万
  • 财政年份:
    1993
  • 负责人:
    NAKAMURA Kengo
  • 依托单位:
海外基金