Development of ultra high strengh gold alloy for adhesion bridege

粘接桥用超高强度金合金的研制

基本信息

  • 批准号:
    61870080
  • 负责人:
  • 金额:
    $ 10.5万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Developmental Scientific Research
  • 财政年份:
    1986
  • 资助国家:
    日本
  • 起止时间:
    1986 至 1987
  • 项目状态:
    已结题

项目摘要

In 1986, sixteen kinds of Au-Pt-Cu-Ag alloys (PTG), containing 70 part of Au+Pt, 30 part of Cu+Ag, 2 part of Zn as a deoxidizer and 0.05 part of Ir as a grain refiner were melted in pure argon atomosphere. Test specimens were made from these alloy ingots using dental precision casting, and the mecanical properties after quenching (softning) and hardening heat treatment were measured. After the hardening heat treatment, tensile strength, elongation, and Vickers hardness of 65Au-5Pt-20Cu-15Ag (PTG-3) and 60Au-10Pt-15Cu-15Ag (PTG-6) alloy were over 95kgf/mm^2, over 2% and over 300, respectively. These two alloys were most optimum among the 16 tested alloys. In addition to these tests, mechanical properties for twelve kinds of Ag-Pd-Cu ternary alloys (AP), containing 25-40wt% Pd, 15-25wt% Cu, were also mesured using the method described above. The 35Pd-20Cu-45Ag ternary alloy had maximum tensile strength after hardening heat treatment. A 10% Au was added to the alloys close to this composi … More tion and their mechanical properties were also measured. 10Au-30Pd-20Cu-40Ag (APG-7) and 10Au-30Pd-25Cu-35Ag (APG-11) were suitable for adhesion bridges from the view of their tensile strength and Vicker's hardness that were 101kgf/mm^2, 343 and 104kgf/mm^2, 358, respectively.In 1987, a method for bond strength was newly developed using two small test pieces(10 , 6h). This method enabled to measure four types of bond strength(sher bond strength by compression loading,tensile bond strength, bending bond strength and torsional shear bond strength). The shear bond strength by compression loading and tensile bond strength were measured for the aforementioned 4 alloys (PTG-3, PTG-6, APG-7, APG-11) with 4META system adhesives (Superbond C&B, SB C&B) and phosphoric ester system adhesives (Panavia EX, PEX). When PEX was used, for all types of alloys, the bond strength on the polished surface was small, however, the bond strength of 400-500kgf/cm^2 was shown on the oxidized surface that was created by the hardening heat tereatment, and on the tin-plated surface. When SB C&B was used, every alloys adhered well with all surfaces, polished, oxidized, and tin-plated surfaces, and their bond strength were over 400kgf/cm^2. It is concluded that if appropriate surface treatment is carried out on precious alloys such as platinum added gold alloys (PTG) and gold-silver-palladium alloys (APG), the shear bond strength by compression loading and tensile bond strength are more than 600kgf/cm^2. Less
1986年,在纯氩气中熔炼了16种Au-Pt-Cu-Ag合金(PTG),其中Au+Pt含量为70份,Cu+Ag含量为30份,Zn为脱氧剂,Ir为细化剂为0.05份。采用齿科精密铸造技术对合金锭进行了试样制备,并对其淬火(软化)和淬火热处理后的力学性能进行了测定。经硬化热处理后,65Au-5Pt-20Cu-15Ag (PTG-3)和60Au-10Pt-15Cu-15Ag (PTG-6)合金的抗拉强度、伸长率和维氏硬度分别大于95kgf/mm^2、2%和300以上。这两种合金在16种被试合金中效果最佳。除上述试验外,还采用上述方法测定了12种含25-40wt% Pd、15-25wt% Cu的Ag-Pd-Cu三元合金(AP)的力学性能。经硬化热处理后,35Pd-20Cu-45Ag三元合金的抗拉强度最大。在接近该成分的合金中加入10%的Au,并对其力学性能进行了测试。10Au-30Pd-20Cu-40Ag (APG-7)和10Au-30Pd-25Cu-35Ag (APG-11)的抗拉强度和维氏硬度分别为101kgf/mm^2、343和104kgf/mm^2、358,适合作为粘接桥材料。1987年,新开发了一种用两个小试件(10,6 h)测定粘结强度的方法。该方法可以测量四种类型的粘结强度(压缩加载的粘结强度、拉伸粘结强度、弯曲粘结强度和扭转剪切粘结强度)。采用4META体系胶黏剂(Superbond C&B、SB C&B)和磷酸酯体系胶黏剂(Panavia EX、PEX)对上述4种合金(PTG-3、PTG-6、APG-7、APG-11)进行了压缩加载剪切强度和拉伸强度的测定。当使用PEX时,对于所有类型的合金,抛光表面的结合强度很小,然而,硬化热处理产生的氧化表面和镀锡表面的结合强度为400-500kgf/cm^2。当使用SB C&B时,每种合金与抛光、氧化和镀锡表面均具有良好的粘附性,其结合强度超过400kgf/cm^2。结果表明,对铂加金合金(PTG)和金银钯合金(APG)等贵重合金进行适当的表面处理,压缩载荷剪切结合强度和拉伸结合强度均可达到600kgf/cm^2以上。少

项目成果

期刊论文数量(10)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
中村健吾,小倉英夫,後藤真一: 歯科材料・器械(特別号). 6. (1987)
Kengo Nakamura、Hideo Ogura、Shinichi Goto:牙科材料和仪器(特刊)6。(1987)。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
Kengo, NAKAMURA: "Properties of casting Au-Pt-Cu-Ag alloys" J J Dent Mat. 6. 54-55 (1987)
Kengo, NAKAMURA:“铸造 Au-Pt-Cu-Ag 合金的特性”J J Dent Mat。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
Toshikuni, OKA: "New Type Adehesion Testing Apparatus" Adhes Dent. 6. 69-70 (1988)
Toshikuni, OKA:“新型粘合力测试装置”粘合凹痕。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
中村健吾: 歯科材料・器械. 6. 54-55 (1987)
Kengo Nakamura:牙科材料和仪器。6. 54-55 (1987)
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
岡邦俊: 接着歯学. 6. 69-70 (1988)
Kunitoshi Oka:粘合牙科。6. 69-70 (1988)
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NAKAMURA Kengo其他文献

Numerical Analysis of a Miniature Microwave-discharge Ion Thruster Using Water as the Propellant
以水为推进剂的微型微波放电离子推进器的数值分析

NAKAMURA Kengo的其他文献

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{{ truncateString('NAKAMURA Kengo', 18)}}的其他基金

Study of Bonding Fatigue Strength by Dental Adhensive Resin
牙科粘接树脂粘接疲劳强度的研究
  • 批准号:
    05404068
  • 财政年份:
    1993
  • 资助金额:
    $ 10.5万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (A)

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  • 批准号:
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  • 批准号:
    08457531
  • 财政年份:
    1996
  • 资助金额:
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  • 项目类别:
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