Studies in PTLP Bonding of Ceramics

陶瓷PTLP键合研究

• 批准号: 06650806
• 负责人: NAKASHIMA Kunihiko
• 金额: $ 1.28万
• 依托单位: KYUSHU UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1994
• 资助国家: 日本
• 起止时间: 1994 至 1995
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-06650806/
• 关键词: PTLP bonding; Ceramic; Joining; Wettability; Alumina; Copper; PTLP接合; 強度; Cu; 80Ni・20Cr合金

Through the use of microdesigned Ni-based interlayrs, PTLP (Partial Transient-Liquid Phase) bonding of alumina has been achieved at 1150ﾟC.The effect of additions (Cr, Ni and 80Ni.20Cr) on the wetting characteristics of liquid Cu on Al_2O_3 has been studied using a sessile drop method at 1150ﾟC.The key conclusions are as follows :(1)At the bonding temperature, some dissolution of Ni and 80Ni.20Cr core layrs into liquid Cu film and the diffusion of liquid Cu into Ni and 80Ni.20Cr core layr occurred.(2)The highest average strength and smallest standard deviation were achieved using Cu/80Ni.20Cr/Cu interlayr. The average four-point flexure strength was 251 MPa and a standard deviation of <plus-minus>29 MPa, and failure proceeded primarily in the ceramic(3)Ni additions have no effect on reducing the contact angle of liquid Cu on an Al_2O_3 substrate. Additions of 80Ni.20Cr or Cr alone reduce the contact angle of liquid Cu on an Al_2O_3 substrate. The contact angle reduction depends upon the Cr content of the sessile drop and anneal time.(4)The results demonstrate that as the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al_2O_3 and facilitate the formation of reliably strong joint of PTLP bonded Al_2O_3 using Cu/80Ni.20Cr/Cu interlayr.

通过使用微设计的ni基夹层，在1150°C的温度下实现了氧化铝的PTLP（部分瞬态液相）键合。添加Cr、Ni和80Ni的影响。在1150℃的温度下，用液滴法研究了液态Cu在Al_2O_3上的润湿特性。主要结论如下：(1)在键合温度下，Ni和80Ni有一定的溶解。20Cr芯层形成液态Cu膜，液态Cu向Ni和80Ni扩散。20Cr核心层发生。(2) Cu/80Ni合金的平均强度最高，标准偏差最小。20 cr /铜interlayr。平均四点抗弯强度为251 MPa，标准差<正负>29 MPa，破坏主要发生在陶瓷中。(3)添加Ni对降低Al_2O_3基体上液态Cu的接触角没有影响。添加80Ni。20Cr或单独使用Cr可降低液态Cu在Al_2O_3衬底上的接触角。接触角的减小取决于熔滴中Cr的含量和退火时间。(4)结果表明，随着键合温度的升高，Cr在Cu液膜中的溶解提高了Cu液膜在Al_2O_3上的润湿性，有利于Cu/80Ni与PTLP键合Al_2O_3形成可靠的强接头。20 cr /铜interlayr。

项目成果

H.Matsumoto: "Wettability of Al_2O_3 by Liquid Cu as Influenced by Additives and Partial Transient Liquid-Phase Bonding of Al_2O_3" Matr.Trans., JIM. Vol.36. 555-564 (1995)

H.Matsumoto：“受添加剂和 Al_2O_3 部分瞬态液相键合影响的液态 Cu 对 Al_2O_3 的润湿性”Matr.Trans.，JIM。

K. Nakashima: "PTLP (Partial Transient Liquid-Phase) Bonding of Alumina using MicrodesignedNi-Based Interlayer" Proc. of the 2nd Pacific Rim Int. Conf. on Advanced Materials and Processing. 1. 729-734 (1995)

K. Nakashima：“使用微设计的镍基中间层进行氧化铝的 PTLP（部分瞬态液相）键合”Proc。

H.Matsumoto: "Wettability of Al_2O_3 by Liquid Cu as Influenced by Additives and Partial Transient Liquid-Phase Bonding of Al_2O_3" Materials Transactions, JIM. 36. 555-564 (1995)

H.Matsumoto：“受添加剂和 Al_2O_3 部分瞬态液相键合影响的液态 Cu 对 Al_2O_3 的润湿性”材料交易，JIM。

K.Nakashima: "PTLP(Partial Transient Liquid-Phase) Bonding of Alumina using Microdesigned Ni-Based Interlayer" Proc. of the 2nd Pacific Rin Int. Conf. on Advanced Materials and Processing. 1. 729-734 (1995)

K.Nakashima：“使用微设计的镍基中间层进行氧化铝的 PTLP（部分瞬态液相）键合”Proc。

H. Matsumoto: "Wettability of Al_2O_3 by Liquid Cu as Influenced by Additives and Partial Transient Liquid-Phase Bonding of Al_2O_3" Materials Transactions, JIM. 36. 555-564 (1995)

H. Matsumoto：“受添加剂和 Al_2O_3 部分瞬态液相键合影响的液体 Cu 对 Al_2O_3 的润湿性”Materials Transactions，JIM。