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Studies on Ultrasonic Micro Welding Using High-Frequency Vibration

Studies on Ultrasonic Micro Welding Using High-Frequency Vibration
高频振动超声微焊接的研究
批准号:
11450279
负责人:
TSUJINO Jiromaru
金额:
$8.9万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
1999
资助国家:
日本
项目状态:
已结题
起止时间:
1999 至 2001

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中文摘要
翻译
研究了27 kHz ~ 800 kHz高频和复杂振动超声焊接系统的振动和焊接特性。具有椭圆到圆形或矩形到正方形轨迹的高频复杂振动系统,可有效地用于包括相同和不同金属样品在内的各种样品的超声焊接,以及各种电子器件的半导体尖端和封装的无焊料直接焊接。该复杂振动系统由一维纵扭变换器、阶梯喇叭和纵向振动换能器作为驱动源组成。27 kHz和100 kHz的复合振动焊头有足够的6 ~ 8 mm平方的面积用于各种焊接试样。0.3 mm ~ 1.0 mm厚度的铝板试件成功连接,焊缝强度与铝试件强度基本相等,且与试件方向无关。100 kHz系统所需的振动幅值小于27 kHz系统所需的振动幅值。此外,提出了40 kHz至200 kHz的纵向-复合横向振动系统,以获得10 mm至20 mm平方的大焊接尖端面积,对应于具有大量凸起的大型半导体尖端与衬底连接。该纵向-复合横向振动系统由一根21 mm方的阶梯形复合横向振动杆、两个直角交叉的横向振动环位置的纵向振动系统和一个带静压源的焊接架组成。复合振动源固定在焊接框架的横向节点位置。40 kHz复合振动焊接尖端振动速度大于1.0 mm/s(峰至零值),整个尖端均匀振动。
英文摘要
The vibration and welding characteristics of high-frequency and complex vibration ultrasonic welding systems of 27 kHz to 800 kHz were studied. High-frequency and complex vibration systems, which have elliptical to circular or rectangular to square locus, are effective for ultrasonic welding of various specimens including the same and different metal specimens, and for direct welding of semiconductor tips and packaging of various electronic devices without solder. The complex vibration systems consist of a one-dimensional longitudinal-torsional vibration converter with slitted parts, a stepped horn and a longitudinal vibration transducer as a driving source. The complex vibration welding tips of 27 kHz and 100 kHz have enough area of 6 mm to 8 mm square for various welding specimens. Aluminum plate specimens of 0.3 mm to 1.0 mm thickness were successfully joined with weld strengths almost equal to aluminum specimen strength, and independent to the specimen direction. Required vibration amplitude of 100 kHz system is less than that of 27 kHz system.Furthermore, the longitudinal-complex transverse vibration systems of 40 kHz to 200 kHz were proposed to obtain large welding tip area such as 10 mm to 20 mm square corresponding to large semiconductor tips with large number of bumps for connecting to the substrates. The longitudinal-complex transverse vibration system consists of a stepped complex transverse vibration rod of 21 mm square, two longitudinal vibration systems which are in the transverse vibration loop positions crossed at a right angle, and a welding frame with a static pressure source. The complex vibration source is fixed at a transverse nodal position in the welding frame. The 40 kHz complex vibration welding tip vibrates at vibration velocity of more than 1.0 mm/s (peak-to-zero value) and vibrates uniformly throughout the tip.
期刊论文(86)
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科研奖励(0)
会议论文
Jiromaru TSUJINO, Tsutomu SANO, Yoshiki HARADA: "Welding characteristics of ultrasonic complex vibration welding systems of 27, 40 and 100 kHz with longitudinal-torsional vibration converters"Proc.of 17th International Congress on Acoustics. 3D.06.06. (20
Jiromaru TSUJINO、Tsutomu SANO、Yoshiki HARADA:“采用纵向扭转振动转换器的 27、40 和 100 kHz 超声波复合振动焊接系统的焊接特性”第 17 届国际声学大会论文集。
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Jiromaru Tsujino, Tsutomu Sano, Hayato Ogata, Soichi Tanaka and Yoshiki Harada: "Complex Vibration Ultrasonic Welding Systems with Large Area Welding Tips"Ultrasonics, Elsevier Science. Vol. 40. (2002)
Jiromaru Tsujino、Tsutomu Sano、Hayato Ogata、Soichi Tanaka 和 Yoshiki Harada:“具有大面积焊接头的复杂振动超声波焊接系统”超声波,Elsevier Science。
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辻野次郎丸: "高周波複合振動ボンダー"超音波TECHNO(日本工業出版). Vol.12,No.4. 18-25 (2000)
Jiromaru Tsujino:“高频复合振动接合器”超声波TECHNO(日本工业出版)第12卷,第18-25期(2000年)。
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辻野次郎丸,佐野努,原田祥樹,笠原光平: "大面積の溶接チップ部を有する複合振動超音波溶接装置について"第21回超音波エレクトロニクスの基礎と応用に関するシンポジウム. 173-174 (2000)
Jiromaru Tsujino、Tsutomu Sano、Yoshiki Harada、Kohei Kasahara:“关于具有大面积焊接尖端的复合振动超声波焊接设备”第 21 届超声波电子学基础与应用研讨会 173-174 (2000)。
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40
    Studies on Ultrasonic Continuous Seam Welding System Using Complex Vibration
    • 批准号:
      11355030
    • 项目类别:
      Grant-in-Aid for Scientific Research (A)
    • 资助金额:
      $16.84万
    • 财政年份:
      1999
    • 负责人:
      TSUJINO Jiromaru
    • 依托单位:
    Ultrasonic Micro-welding Using High-Frequency and Complex Vibrations
    • 批准号:
      07555530
    • 项目类别:
      Grant-in-Aid for Scientific Research (A)
    • 资助金额:
      $5.18万
    • 财政年份:
      1995
    • 负责人:
      TSUJINO Jiromaru
    • 依托单位:
    Studies on Continuous Ultrasonic Butt Welding
    • 批准号:
      01420021
    • 项目类别:
      Grant-in-Aid for General Scientific Research (A)
    • 资助金额:
      $14.27万
    • 财政年份:
      1989
    • 负责人:
      TSUJINO Jiromaru
    • 依托单位:
    Studies on Ulltrasonic Butt Welding
    • 批准号:
      60850026
    • 项目类别:
      Grant-in-Aid for Developmental Scientific Research
    • 资助金额:
      $9.28万
    • 财政年份:
      1985
    • 负责人:
      TSUJINO Jiromaru
    • 依托单位:
    海外基金