Development of Thin and Flexible Heat-Spreading Plate

薄型柔性散热板的开发

基本信息

批准号：
12555054
负责人：
NISHIO Shigefumi
金额：
$ 4.99万
依托单位：
The University of Tokyo
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-12555054/
关键词：
Heat conduction Heat diffusion Heat spreader Heat pipe Flexible LSI device cooling 熱工学熱管理振動流蒸発凝縮 LSIチップ

项目摘要

To cope with rapid increase of heat generation rates of LSI devices, thin and flexible heat-spreading plates were developed using SEMOS heat pipes or COSMOS heat pipes. In the present study, we focused on COSMOS heat pipes which have high potential for flexibility.Thin and flexible heat-spreading plates containing a COSMOS heat pipe were fabricated with a rapid proto typing method. The plates were made by an acrylic resin. Using the fabricated plates, the pressure drop and the phase shift for the displacement of oscillating flow were measured for parameters such as the size, length, number of the channel in addition to the amplitude and frequency of the oscillating flow for water. Since analytical predictions of the flow characteristics at the curved channels in COSMOS heat pipes are difficult, they were estimated based on the experimental data and correlations for them were proposed to establish the design method of COSMOS heat pipes. The results indicate that the power driving oscillating flows in the curved channel is within two times of that for the straight channel with the same length.Heat transport experiments were conducted for a typical heat-spreading plate. Experimental results show that the heat transport rate of the plate made of the acrylic resin is ten times larger than that of a copper plate. Combining the results of heat transport rates with those of flow characteristics mentioned above, the performance coefficient which is the ratio of the heat transport rate to the power driving oscillating flows was calculated. The result show that the lowest value of the performance coefficient obtained in the present experiments was 200 and it was found that the present heat-spreading plate can transport a large amount of heat with a small power supply.

为了应对LSI设备的热量产生速率的快速增加，使用SEMOS热管或Cosmos热管开发了薄且柔性的热量板。在本研究中，我们专注于具有柔韧性潜力很高的宇宙热管。用快速的原始键入方法制造了含有宇宙热管的薄和柔性热板。板是由丙烯酸树脂制成的。使用制造的板，测量了振荡流的位移的压降和相移的参数，例如大小，长度，通道数，除了水的振幅和频率外，水的振幅和频率。由于很难对cosmos热管中弯曲通道的流量特征进行分析预测，因此根据实验数据进行了估计，并提出了相关性来建立宇宙热管的设计方法。结果表明，弯曲通道中的功率驱动振荡流在其两次之内，对于直径相同的直道，进行了相同的长度。进行了典型的热量散热板进行热传输实验。实验结果表明，由丙烯酸树脂制成的板的热传输速率比铜板大十倍。将热传输速率与上述流量特性的结果结合起来，该性能系数是热传输速率与动力驱动振荡流的比率。结果表明，在本实验中获得的性能系数的最低值为200，发现目前的热量板板可以以较小的电源运输大量热量。