New Methods and Microelectronics for Wireless Communication Systems

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Global demand for high quality wireless communications poses significant challenges. The so-called "physical layer" is crucial, as this is where the vagaries of the wireless channel, including interference and limited bandwidth, are mitigated by sophisticated signal processing. This project will conduct applied research to meet these physical layer challenges, providing solutions that feed directly into next generation wireless communication systems. Uniquely, this project focuses on the transfer of research from theoretical genesis, through to realisation of silicon integrated circuit "chips". This will maximise both the impact of the research and the potential for significant national economic benefits to accrue.