Development of the HEMA free total-etch adhesive system

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This study was to investigate the accumulation and the possibility of utilization of the fundamental knowledge for HEMA free total etch adhesive systems development were performed. All teeth were subjected to a bonding treatment strictly according to the manifacture's instruction, with total etch adhesives, Unifil Bond (UH, JISHI) and Clearfil Linerbond II (CL II, Kuraray), Clearfil Mega Bond (CMB, Kuraray), One up Bond F (OBF, Tokuyama), HEMA-free in total etching systems (trial production, GC). All specimens were randomly divided into 3 groups (CMB, OBF, HEMA-free) of 6 teeth each, and subjected to μTBS-testing after 24 hour's storage in water at 37℃. Consequently, each of UB, CL II, and CMB became clear that the very thin hybrid layer with a thickness of 0.5-1 micrometer is formed by the adhesion interface with dentine. In the adhesion examination, although a significant difference was not accepted in CMB and a trial production self etching system, the significant difference was accepted by OBF and the trial production. Then, it is thought including adhesion durability, such as giving thermalcycle stress, that it is necessary to add consideration synthetically Moreover, in this time, it was suggested by choosing a suitable functional monomer and suitable polymer that utilization of a HEMA free total etch adhesive system are possible