Development of the HEMA free total-etch adhesive system
开发无 HEMA 全蚀刻粘合剂系统
基本信息
- 批准号:14571815
- 负责人:
- 金额:$ 1.86万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (C)
- 财政年份:2002
- 资助国家:日本
- 起止时间:2002 至 2003
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
This study was to investigate the accumulation and the possibility of utilization of the fundamental knowledge for HEMA free total etch adhesive systems development were performed. All teeth were subjected to a bonding treatment strictly according to the manifacture's instruction, with total etch adhesives, Unifil Bond (UH, JISHI) and Clearfil Linerbond II (CL II, Kuraray), Clearfil Mega Bond (CMB, Kuraray), One up Bond F (OBF, Tokuyama), HEMA-free in total etching systems (trial production, GC). All specimens were randomly divided into 3 groups (CMB, OBF, HEMA-free) of 6 teeth each, and subjected to μTBS-testing after 24 hour's storage in water at 37℃. Consequently, each of UB, CL II, and CMB became clear that the very thin hybrid layer with a thickness of 0.5-1 micrometer is formed by the adhesion interface with dentine. In the adhesion examination, although a significant difference was not accepted in CMB and a trial production self etching system, the significant difference was accepted by OBF and the trial production. Then, it is thought including adhesion durability, such as giving thermalcycle stress, that it is necessary to add consideration synthetically Moreover, in this time, it was suggested by choosing a suitable functional monomer and suitable polymer that utilization of a HEMA free total etch adhesive system are possible
本研究旨在探讨HEMA自由全蚀刻胶粘剂系统开发的基础知识积累和利用的可能性。所有牙齿严格按照制造商的说明进行粘接处理,使用全蚀刻胶,Unifil Bond (UH, JISHI)和Clearfil Linerbond II (CL II, Kuraray), Clearfil Mega Bond (CMB, Kuraray), One up Bond F (OBF, Tokuyama),全蚀刻系统中不含hema(试验生产,GC)。将标本随机分为3组(CMB组、OBF组、不含hema组),每组6颗牙,37℃水中保存24 h后进行μ tbs测试。因此,UB, CL II和CMB都清楚地表明,与牙本质的粘附界面形成了厚度为0.5-1微米的极薄杂化层。在附着力检测中,虽然CMB和试制自蚀刻系统不接受显著差异,但OBF和试制系统接受显著差异。然后,认为包括粘接耐久性,如给予热循环应力,有必要综合考虑。在此期间,建议通过选择合适的功能单体和合适的聚合物,利用无HEMA的全蚀刻粘接体系是可能的
项目成果
期刊论文数量(16)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Satoki Shibata: "Filler Decontamination Methods Improving Degradation of Resin Composites"Asia Bioceramics congress. 57-62 (2003)
Satoki Shibata:“改善树脂复合材料降解的填料去污方法”亚洲生物陶瓷大会。
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Kenichi Shirai: "Long-term durability of resin-denim bond in class I cavity using various adhesive systems"The Japanese Journal of conservative Dentistry. 46-Spring issue. 121 (2003)
Kenichi Shirai:“使用各种粘合剂系统在 I 类空腔中实现树脂-牛仔布粘合的长期耐久性”《日本保守牙科杂志》。
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白井 憲一: "I級窩洞に応用した各種象牙質接着システムの長期接着耐久性について"日本歯科保存学雑誌. 46. 121 (2003)
Kenichi Shirai:“应用于 I 类蛀牙的各种牙本质粘合剂系统的长期粘合耐久性”日本保守牙科杂志 46. 121 (2003)。
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荒川 真: "回転切削器具により切削した象牙質に対する接着強さ"日本歯科保存学雑誌. 46. 74 (2003)
Makoto Arakawa:“用旋转切割仪器切割牙本质的粘合强度”日本保守牙科杂志 46. 74 (2003)。
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Satoki, Shibata: "Filler Decontamination Methods Improving Degradation of Resin Composites"Asia bioceramics journal. 3. (2003)
Satoki, Shibata:“改善树脂复合材料降解的填料去污方法”亚洲生物陶瓷杂志。
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