Development of Elevated Temperature Fatigue Testing Technique for Micro Components used in Micro Power Generating Systems

微型发电系统微型部件高温疲劳试验技术的开发

• 批准号: 16560086
• 负责人: LEE Yeonkyeon
• 金额: $ 2.37万
• 依托单位: Ritsumeikan University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2004
• 资助国家: 日本
• 起止时间: 2004 至 2005
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16560086/
• 关键词: Fatigue Life; Bending Testing; Atomic Force Microscope; Silicon; Cantilever; Micro Structural Design; 疲労革命; Atomic Force Microscope

Single crystal silicon (SCS) micro components used in MEMS often suffer from cyclic fatigue damage due to their fluctuating motion. Evaluating fatigue damage as well as quasi-static mechanical properties of micro SCS structures is essential for safe operation and life extension of MEMS. The authors have so far carried out high cyclic fatigue tests of microscale SCS specimens under uniaxial tensile and one-directional bending stressing at elevated temperatures. Here, the applicable parameter to predict fatigue lives of SCS was proposed on a broad-range of specimen size from nanoscale to microscale. However, SCS components in MEMS would undergo not only tensile stress but also compressive stress. For example, components used in silicon based power MEMS, such as micro turbo machinery and micro reciprocating engine operating at high temperatures ; usually receive tension/compression fatigue damage with lower strain rate attributed to cyclic thermal hysteresis at the start/stop of the devic … More es. Optical micro switches will be also subject to tension-compression cyclic loading in a full-reversed bending deformation. In order to establish a reliable design criterion for silicon-based MEMS, new damage evaluation technique under cyclic tensile/compressive loads is required. This research developed a full-reversed bending fatigue tester that can apply cyclic tensile/compressive loads to a microscale SCS specimen using twin thick-cantilevers.A novel full-reversed bending fatigue tester was developed for cyclic fatigue damage evaluation of MEMS materials. This paper focuses on ; 1)the design of the micro fatigue tester ; 2)establishment of the bending fatigue testing procedure ; and 3)revealing fatigue lives of microscale single crystal silicon (SCS) specimens. In fatigue testing, an SCS specimen was reciprocated between the twin thick-cantilevers to induce tensile and compressive stresses at both fixed ends of the specimen, respectively. The twin cantilevers played two roles ; one is as an indenter for bending and the other as a detector of cyclic loads applied to a specimen. The bending loads were measured by the deflection of the twin cantilevers using a laser reflection system based on AFM technique. Quasi-static bending tests of micro SCS specimens demonstrated the measurement accuracy of bending force and reliability of the displacement control systems of the tester. We succeeded the full-reversed cyclic bending tests, whereby the elastic stress-strain hysteresis loops of micro SCS specimen was obtained. This research will propose an effective parameter to predict fatigue lives of microscale SCS without respect to test conditions. Less

用于MEMS的单晶硅（SCS）微元件由于其波动运动而经常遭受循环疲劳损伤。评价微结构的疲劳损伤和准静态力学性能对MEMS的安全运行和寿命延长至关重要。到目前为止，作者已经在高温下进行了微尺度SCS试件在单轴拉伸和单向弯曲应力下的高循环疲劳试验。在此基础上，提出了从纳米尺度到微尺度的试样尺寸范围内预测SCS疲劳寿命的适用参数。然而，MEMS中的SCS元件不仅要承受拉应力，还要承受压应力。例如，在硅基功率MEMS中使用的组件，如在高温下工作的微型涡轮机械和微型往复式发动机；由于设备启动/停止时的循环热滞后，通常会受到较低应变率的拉伸/压缩疲劳损伤。光学微动开关在完全反向弯曲变形时也会受到拉压缩循环载荷的影响。为了建立可靠的硅基MEMS设计准则，需要新的循环拉伸/压缩载荷下的损伤评估技术。本研究开发了一种全反向弯曲疲劳测试仪，可以使用双厚悬臂梁对微尺度SCS试样施加循环拉伸/压缩载荷。为评价MEMS材料的循环疲劳损伤，研制了一种新型的全反向弯曲疲劳试验机。本文主要研究；1)微疲劳试验机的设计；2)建立弯曲疲劳试验规程；3)揭示微尺度单晶硅（SCS）试样的疲劳寿命。在疲劳测试中，在双厚悬臂梁之间往复往复，分别在试件的固定端产生拉应力和压应力。双悬臂梁起两个作用；一种是作为弯曲的压头，另一种是作为施加在试样上的循环载荷的检测器。利用基于原子力显微镜技术的激光反射系统测量了双悬臂梁的挠度。微SCS试件的准静态弯曲试验验证了该试验机弯曲力测量的准确性和位移控制系统的可靠性。我们成功地进行了全反向循环弯曲试验，得到了微型SCS试件的弹性应力-应变滞回曲线。本研究将提供一个有效的参数来预测微尺度SCS的疲劳寿命，而不受试验条件的影响。少

项目成果

New fatigue damage evaluation of MEMS materials under tension-compression cyclic loading

• DOI: 10.1109/memsys.2005.1453962
• 发表时间: 2005-07
• 期刊: 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005.
• 作者: Y. Isono;H. Kito;T. Kikuchi;T. Shimazu;M. Katayama

Development of Full-reversed Bending Fatigue Tester Based on AFM Technique for Cyclic Damage Evaluation of MEMS

基于AFM技术的MEMS循环损伤评估全反向弯曲疲劳试验机的研制

• 发表时间: 2005
• 期刊: Key Engineering Materials Vol297-300
• 作者: Yoshitada Isono;Takanori Kikuchi;Hiroaki Kitoh
• 通讯作者: Hiroaki Kitoh

Mechanical Characterization of Single Crystal Silicon and UV-LIGA Nickel Thin Films Using Tensile Tester operated in AFM

使用 AFM 拉伸测试仪对单晶硅和 UV-LIGA 镍薄膜进行机械表征

• 发表时间: 2005
• 期刊: Fatigue and Fracture of Engineering Materials and Structures, Blackwell Publishing 28
• 作者: Yeonkyeong Lee;Tada Junichi;Yoshitada Isono
• 通讯作者: Yoshitada Isono