Development and Analysis of New Conductor Materials for Electronic Industry

电子工业新型导体材料的开发与分析

• 批准号: 16560575
• 负责人: KAJIHARA Masanori
• 金额: $ 2.11万
• 依托单位: Tokyo Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2004
• 资助国家: 日本
• 起止时间: 2004 至 2005
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16560575/
• 关键词: Conductor materials; Reactive diffusion; Intermetallics; Soldering; Electronic devices; Pb-free solders; Eco-materials; 電子材料; 固相反応; 固相接合

Sandwich Sn/(Au-Ag)/Sn diffusion couples were prepared from pure Sn and binary Au-Ag alloys with different Ag concentrations by a diffusion bonding technique. The diffusion couples were isothermally annealed at temperatures between 433 and 473 K for various times in an oil bath with silicone oil. For the cross-section of the annealed diffusion couple, the microstructure was observed by scanning electron microscopy and the chemical composition of each phase was determined by electron probe microanalysis. According to the observation, intermetallic layers consisting of binary Au-Sn and Ag-Sn compounds are formed at the interface of the diffusion couple due to the reactive diffusion between the binary Au-Ag alloy and pure Sn. The total thickness of the intermetallic layers is proportional to a power function of the annealing time. The exponent of the power function takes values between 0.3 and 0.5 depending on the composition of the Au-Ag alloy. When the exponent is equal to 0.5, the growth of the intermetallic layer is controlled by volume diffusion. On the other hand, grain boundary diffusion as well as volume diffusion contributes to the rate-controlling process, if the exponent is smaller than 0.5. Thus, the rate-controlling process varies depending on the composition of the Au-Ag alloy. The proportionality coefficient of the power function also changes depending on the composition of the Au-Ag alloy. The minimum value of the proportionality coefficient is realized for the concentration of 87 at% Ag. This means that the growth rate of the intermetallic layer is most sluggish for the Au-87Ag alloy. The intermetallic layer is brittle and possesses high electrical resistivity. As a result, it is concluded that the Au-87Ag alloy is an excellent conductor material with resistance against the reactive diffusion under usual energization heating conditions.

以不同银浓度的纯锡和二元金银合金为原料，采用扩散键合技术制备了夹层Sn/(Au-Ag)/Sn扩散偶联。将扩散偶在433 ~ 473 K温度下用硅油在油浴中等温退火。通过扫描电镜观察退火后的扩散偶截面的微观组织，通过电子探针微量分析确定各相的化学成分。观察发现，由于二元Au-Ag合金与纯Sn之间的反应扩散，在扩散偶界面形成由二元Au-Sn和Ag-Sn化合物组成的金属间层。金属间层的总厚度与退火时间的幂函数成正比。幂函数的指数取值在0.3和0.5之间，这取决于Au-Ag合金的成分。当该指数为0.5时，金属间层的生长受体积扩散控制。另一方面，当指数小于0.5时，晶界扩散和体积扩散都对速率控制过程起作用。因此，速率控制过程取决于Au-Ag合金的成分。幂函数的比例系数也随金银合金成分的不同而变化。在% Ag浓度为87时，比例系数最小。这意味着Au-87Ag合金的金属间层生长速度最慢。金属间层易碎，具有较高的电阻率。结果表明，在常规通电加热条件下，Au-87Ag合金具有良好的抗反应扩散性能。

项目成果

Reactive diffusion between Ag-Au alloys and Sn at solid-state temperatures

固态温度下 Ag-Au 合金和 Sn 之间的反应扩散

• 期刊: Mater.Sci.Eng.A (in press)
• 作者: T.Takenaka;M.Kajihara;N.Kurokawa;K.Sakamoto
• 通讯作者: K.Sakamoto

Fast penetration of Sn into Ag by diffusion induced recrystallization

• DOI: 10.2320/matertrans.47.822
• 发表时间: 2006-03
• 期刊: Materials Transactions
• 影响因子: 1.2
• 作者: T. Takenaka;M. Kajihara

Reactive diffusion between Pd and Sn at solid-state temperatures

• DOI: 10.1016/j.msea.2005.06.054
• 发表时间: 2005-10
• 期刊: Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
• 影响因子: 6.4
• 作者: T. Takenaka;M. Kajihara;N. Kurokawa;K. Sakamoto

Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433 to 473 K

433 至 473 K 退火期间 Sn/Cu/Sn 扩散偶中化合物层的生长行为

• 发表时间: 2005
• 期刊: Mater. Sci. Eng. A 396・1
• 作者: T.Takenaka;M.Kajihara et al.
• 通讯作者: M.Kajihara et al.

Growth behavior of Nb_3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb

Cu-8.3Sn合金与Nb反应扩散过程中Nb_3Sn层的生长行为

• 发表时间: 2005
• 期刊: Mater.Sci.Eng.A 404・1-2
• 作者: Y.muranishi;M.Kajihara
• 通讯作者: M.Kajihara