Advanced Siloxane Waveguide Devices for Telecommunications

该项目将开发制造紧凑，高性能光子集成电路（PIC），用于未来的电信网络，由RPO Pty有限公司商业化的专有无机聚合物玻璃（IPG）薄膜。需要新的制造方法来克服RPO Pty有限公司使用的IPG图案化方法的局限性。研究将集中在硬接触光刻结合干法（等离子体）蚀刻以及离子束铣削;激光加工或UV写入用于光栅生产。IPG对这些技术提出了特殊的挑战。项目成果将包括新的加工方法和在IPG中制造创新PIC的示范。

This project will develop new methods for fabricating compact, high performance photonic integrated circuits (PICs) for use in future telecommunications networks in films of proprietary Inorganic Polymer Glasses (IPGs) commercialised by RPO Pty Ltd. New fabrication methods are required to overcome limitations of the current approach to patterning IPGs used by RPO Pty Ltd. Research will concentrate on hard contact lithography in conjunction with dry (plasma) etching as well as ion beam milling; laser machining or UV writing for grating production. IPGs present special challenges for these technologies. The project outcomes will include new approaches to processing and the demonstration of the fabrication of innovative PICs in IPGs.