Silicon Imaging Device Construction Facility - Wirebonder

最先进的高精度半导体成像设备(用于高能粒子物理、同步加速器科学和医学成像)的发展要求现代组装设施具有显著的能力。在构建由细粒度、多通道裸硅或其他半导体成像器件和定制电子芯片组成的测试和生产模块时，高可靠性、高度灵活的引线键合机是必不可少的工具。首席调查员在几个具有挑战性的项目中成功地在困难的条件下获得了国际声誉，导致除了一个可预见的设备开发计划外，还有几个项目正在计划中。一台现代化的引线键合机，取代现有的已有30年历史的机器，已成为保持我们在该领域的领先地位的关键。

The development of state-of-the-art, high precision semiconductor imaging devices (for high energy particle physics, synchrotron science and medical imaging ) requires a significant capability in modern assembly facilities. In constructing test and 'production' modules consisting of fine-grained, multi-channel bare silicon or other semiconductor imaging devices and custom electronic chips, a high-reliability, highly flexible wire-bonding machine is an essential tool. The international reputation from success in several challenging projects under difficult conditions, gained by the Chief Investigators has resulted in several more projects being planned in addition to a foreseen program of device development. A modern wirebonder, to replace the existing 30 year-old machine, has become critical to maintain our leading position in this area.