Silicon Imaging Device Construction Facility - Wirebonder

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The development of state-of-the-art, high precision semiconductor imaging devices (for high energy particle physics, synchrotron science and medical imaging ) requires a significant capability in modern assembly facilities. In constructing test and 'production' modules consisting of fine-grained, multi-channel bare silicon or other semiconductor imaging devices and custom electronic chips, a high-reliability, highly flexible wire-bonding machine is an essential tool. The international reputation from success in several challenging projects under difficult conditions, gained by the Chief Investigators has resulted in several more projects being planned in addition to a foreseen program of device development. A modern wirebonder, to replace the existing 30 year-old machine, has become critical to maintain our leading position in this area.