Studies on Micro Plastic Working

电子工业的最新发展需要一种高生产率的小孔穿孔技术。在本项目中，尝试将首席研究员最近提出的使用粘塑性压力介质(VM工艺)的一种新的制造工艺应用于这种穿孔。所得结果总结如下：1。单细孔穿孔研究：在第一阶段(1986年)，将VM工艺应用于单细孔穿孔，以检验其有效性。结果表明，该工艺成功地穿透了碳钢和镍箔的各种细孔，这是传统剪切工艺无法获得的：例如，直径50微米的圆孔和50米宽的狭缝。对穿孔压力进行了理论分析。多个细孔的多穿孔研究：在第二个学期(1987年)，多个细孔的多穿孔被作为一个更实际的问题进行了尝试，采用了VM过程。对电子铜箔的穿孔进行了显微观察，阐明了穿孔的形成机理。虽然在有限的条件下，该工艺成功地一次获得了直径50微米、节距75微米的圆孔，这是常规剪切无法实现的。此外，还开发了一种用于精密穿孔的新技术(原子力显微镜方法)。

Recent developments in the electronics industries requre a piercing techniquefor fine holes at a high production rate. In the present project, it was attempted to apply to such piercing a new manufacturing process using a viscoplastic pressure medium (VM process), recently proposed by the head investigator. Theresults obtained are summarized as follows.1. Investigations into single fine hole piercing:In the first term (in 1986), the VM process was applied to piercing of a single fine hold in order to examine its validity. As a result, the process was shown to be successful in piercing various fine holes through carbon steel and nickel foils, unobtainable by the conventional shearing process: for example, a circular hole of 50 <micrn>m in diameter and a slit of 50 m in width. The piercing pressure was analyzed theoretically.2. Investigations into multipiercing of plural fine holes:In the second term (in 1987), multipiercing of plural fine holes was attempted as a more practical problem, employing the VM process. The appearance of the holes pierced through electronics copper foils was examined microscopically, and the mechanism of the hole formation was clarified. Though under a limited condition, the process was successful in obtaining the circular holes 50 <micrn>m in diameter and 75 (micrn)m in pitch with one shot, impossible by the conventional shearing. Furthermore, a new technique (AFM method) for precise piercing of fine holes was developed.