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Measurement of Grinding Temperature of Ceramics

陶瓷研磨温度的测量

基本信息

批准号：
61550095
负责人：
TAKASHI Ueda
金额：
$ 1.15万
依托单位：
Kanazawa University (1988)Osaka University (1986-1987)
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1986
资助国家：
日本
起止时间：
1986 至 1988
项目状态：
已结题

项目摘要

Heat gqnerated in the contact area between a diamond wheel and a ceramic is a main cause of the deterioration in the finished surface of the ceramic and the decrease of the lifetime of the diamond wheel. The temperature at the cutting point is a significant factor in any examination of the cutting mechanism of diamond grains in ceramic grinding. In this study, the temperature of the working grains on the diamond wheel just after cutting and the heat pulses produced by cutting grains in the surface layer of a ceramic are measured using an infrared radiation pyrometer, with the radiation transmitted through an optical fiber. The ceramics used as a workpiece are Si_3N_4 and SiC. The maximum temperature at 40 depth below the ground surface is approximately 500゜C, which is much smaller than that of the carbon steel. Since the conductivity of the ceramic is very small. The temperature of the working grains on a diamond wheel is greater than 1200゜C.

金刚石砂轮与陶瓷接触区产生的热是导致陶瓷加工表面劣化和金刚石砂轮寿命降低的主要原因。在陶瓷磨削中，切削点的温度是研究金刚石颗粒切削机理的一个重要因素。在这项研究中，金刚石砂轮上的工作颗粒的温度刚刚切割后和切割颗粒在陶瓷的表面层中产生的热脉冲使用红外辐射高温计，与辐射通过光纤传输。作为工件的陶瓷是Si_3N_4和SiC。地面以下40度深度处的最高温度约为500 ° C，比碳钢的温度低得多。因为陶瓷的导电性很小。金刚石砂轮上工作颗粒的温度大于1200摄氏度。