NOVEL MICROWAVE TECHNOLOGIES AND DESIGN TECHNIQUES FOR MULTILAYER CIRCUITS FOR WIRELESS COMMUNICATIONS

由于集成无源元件的进展缓慢，移动电话和其他无线设备的小型化受到限制。低温共烧陶瓷（LTCC）和微机电系统（MEMS）两项新技术提供了显著小型化射频和微波电路的能力，并提高了它们的效率和能力。该提案涉及新型微波技术的发展，以及用于3G及以后无线通信的先进LTCC材料和基于LTCC和MEMS的小型化电路的优化、表征、仿真、设计和制造技术。该项目的成果将为澳大利亚电信业带来重大利益。

Miniaturization of mobile handsets and other wireless equipment is limited by the slow progress in integrating passive elements. Two novel technologies Low Temperature Co-fired Ceramics (LTCC) and Micro Electro Mechanical Systems (MEMS) offer the capacity to significantly miniaturise RF and microwave circuits and increase their efficiency and capabilities. The proposal deals with development of novel microwave technologies and techniques for optimization, characterization, simulation, design and fabrication of advanced LTCC materials and LTCC and MEMS based miniaturized circuits for 3G and beyond of Wireless Communication. The outcomes of the project will be of significant benefit to the Australian Telecommunications industry.