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Convective Heat Transfer in Porous Media and Development of Micro-channel Cooling

多孔介质中的对流传热及微通道冷却的发展

基本信息

批准号：
01550174
负责人：
KITAMURA Kenzo
金额：
$ 0.96万
依托单位：
Toyohashi University of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1989
资助国家：
日本
起止时间：
1989 至 1990
项目状态：
已结题

项目摘要

Since the invention of the silicon integrated circuit (IC), there has been in excess of a five-orders-of-magnitude increase in circuit integration. This increase in circuit integration causes higher power density at the chip level.It is relatively common for today's chip to dissipate on the order of 10w/cm^2, and dissipation requirements on the order of 100w/cm^2 are projected for tomorrow's chip. A micro-channel heat sink is one of the candidates that have potential capability of cooling for such high heat flux surface. In this study, heat transfer and fluid flow were investigated both experimentally and analytically on the micro-channel heat sinks. Water-cooled, copper heat sinks with different channel widths and fin heights were fabricated and tested.Special attentions are focused on the removable heat by the heat sinks under the given conditions of the inlet coolant temperature Ti, and the maximum allowable temperature Tmax, of the heat sinks. The results of the heat transfer show very high cooling capability, the heat flux of several hundreds W/cm^2 can be dissipated by the present heat sinks at Ti=20C and Tmax=80C.Pressure losses between the inlet and outlet of the micro-channel were also measured, and it was found that the optimal channel width, which can minimize the pressure loss, exists for fixed removed heat. The fully-developed, laminar, channel flow analysis was also developed to make an optimum design of micro-channels. The analysis predicts fairly well the experimental results.

自硅集成电路 (IC) 发明以来，电路集成度已增加了五个数量级以上。电路集成度的提高导致了芯片级功率密度的提高。当今芯片的功耗在 10w/cm^2 左右是比较常见的，预计未来芯片的功耗要求在 100w/cm^2 左右。微通道散热器是具有冷却如此高热通量表面的潜在能力的候选者之一。在这项研究中，对微通道散热器的传热和流体流动进行了实验和分析研究。制造并测试了具有不同通道宽度和翅片高度的水冷铜散热器。特别关注在给定冷却剂入口温度 Ti 和散热器最大允许温度 Tmax 的条件下散热器可去除的热量。传热结果显示出非常高的冷却能力，在Ti=20C和Tmax=80C时，现有散热器可以消散数百W/cm^2的热通量。还测量了微通道入口和出口之间的压力损失，发现对于固定的排热量，存在可以最小化压力损失的最佳通道宽度。还开发了完全开发的层流通道流动分析，以对微通道进行优化设计。该分析很好地预测了实验结果。