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Mechanisms of and Affecting Factors on the Metal-Ceramic Joining

金瓷连接机理及影响因素

基本信息

批准号：
02302078
负责人：
MOROZUMI Shotaro
金额：
$ 3.97万
依托单位：
Tohoku University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Co-operative Research (A)
财政年份：
1990
资助国家：
日本
起止时间：
1990 至 1992
项目状态：
已结题

项目摘要

This project was composed of seventeen individual research works on metal-ceramic joining, which can be conventionally classified into the following three categories; joining reaction processes, joined interfaces, and mechanical properties of joints. Materials used were Al, Cu, Mo, Nb, Ni, V, W, or their alloys as metallic materials, Al_2O_3, AlN, MgO, PSZ, Si, Sialon, SiC, Si_3N_4, TiB_2, ZrB_2, Diamond as ceramics, and pure metals, and Al, Cu, or Ag-Cu Alloys containing active metals as filler metals. Combining these materials. Metal-ceramic systems with or without fillers were joined and examined for structure and properties of joined interfaces. Results obtained are as follows: (1) In joining reaction processes study, formation and growth mechanisms of reaction layer by vapor metallization, effects of shape and treatment of the surface of ceramics on the residual stress of joints, effects of specific additives to ceramics on the bond strength, crystallographic relationships between … More ceramic and reaction layer, effect of specific additives to filler metals on the thickness of reaction layer, effects of applied electric field on the segregation of active metals in the filler, control of wettability by changing the amount of active metals in the filler, and effect of surface conditions on the wettability to the filler, were studied. (2) In joined interface study, useful pieces of information on crystallographic coherency, atomic structure, relaxation of residual stress, and behavior of lattice defects were obtained mainly by high resolution transmission electron microscopy, as well as theoretical consideration from atomistic and electronic points of view. (3) In the study of mechanical properties of joints, available methods for relaxation of residual stress by insertation of functionally gradient materials, metallization, control of the thickness of reaction layer, and two step joining were realized, as well as improvement of analysis for interfacial stress by molecular dynamics and modeling, and also of measurement of the stress by ultrasonic microscopy. Less

该项目由17项关于金属-陶瓷连接的单独研究工作组成，通常可分为以下三类：连接反应过程、连接界面和连接的力学性能。材料包括作为金属材料的Al、Cu、Mo、Nb、Ni、V、W或其合金，作为金属材料的Al_2O_3、AlN、MgO、PSZ、Si、Sialon、SiC、Si_3N_4、TiB_2、ZrB_2、作为陶瓷和纯金属的金刚石，以及以活性金属为填充金属的Al、Cu或Ag-Cu合金。将这些材料结合在一起。对含或不含填料的金属-陶瓷系统进行了连接，并对连接界面的结构和性能进行了研究。(1)在连接反应过程的研究中，研究了气相金属化反应层的形成和生长机理，陶瓷表面的形状和处理对接头残余应力的影响，陶瓷中特定添加剂对结合强度的影响，…之间的结晶学关系。研究了更多的陶瓷和反应层，特定添加剂对反应层厚度的影响，外加电场对活性金属在填料中偏析的影响，通过改变填料中活性金属量来控制润湿性，以及表面条件对填料润湿性的影响。(2)在对接界面的研究中，主要利用高分辨电子显微镜，并从原子学和电子学的角度进行理论研究，获得了有关晶体的共格、原子结构、残余应力松弛和晶格缺陷行为等方面的有用信息。(3)在接头力学性能的研究中，实现了通过插入功能梯度材料、金属化、控制反应层厚度和两步连接等方法来松弛残余应力，改进了分子动力学和模型化的界面应力分析方法和超声显微镜应力测量方法。较少