Analysis of Heat Transfer Process of Plug Formation for VLSI by Laser Radiation

激光辐射超大规模集成电路插塞成型传热过程分析

• 批准号: 03650192
• 负责人: OKADA Masashi
• 金额: $ 1.34万
• 依托单位: Aoyama Gakuin University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1991
• 资助国家: 日本
• 起止时间: 1991 至 1992
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-03650192/
• 关键词: Metallization; Plug Formation; Planarization; Radiative Melting; MAC Method; Heat Transfer Analysis; Surface Tension; Free surface; ビアホ-ルの埋め込み; 配線の平担化

In order to get basic Knowledge for improving reliability of plug formation for VLSI by a Laser radiation, the two processes that a metal was melted by the laser radiation, and the molten metal flowed and solidified, were investigated analytically and experimentally. The following results were obtained.As a model of the first process, ice (semitransparent material for radiation energy) in an open-top rectangular dimple in a substrate was melted by radiation of a heat source from above, where the size of the dimple was large enough to neglect the effect of surface tension. The analysis and the experiment for the model were made. From the comparison of analytical results with experimental results, the effectiveness of the present analysis was shown. Besides, the influences of blackbody temperature of heat source, the material of the substrate, air bubbles in ice and thermal condition of the substrate on the first process were clarified.As a model of the second process, a pure metal with a microscopic hole was melted by laser radiation from above and the molten metal flowed into the hole and then solidified, where the size of the hole was so small that the surface tension of the molten metal had to be considered. The analysis and experiment for the model were made. From the comparison of analytical results with experimental results, it was clarified that the present analysis could qualitatively simulate the second process. Besides, the results of the analysis performed for the practical hole size and time scale, showed transient behavior of metal from melting to solidification. It was clarified that surface tension mainly governed the phenomenon that molten metal flowed into the microscopic hole.

为了为提高超大规模集成电路中激光形成插头的可靠性提供基础知识，对激光熔化金属和熔融金属流动和凝固两个过程进行了分析和实验研究。得到了以下结果：作为第一种过程的模型，基底上的开顶矩形凹痕中的冰（用于辐射能量的半透明材料）在上方热源的辐射下熔化，其中凹痕的尺寸足够大，可以忽略表面张力的影响。对模型进行了分析和实验。通过分析结果与实验结果的比较，证明了分析的有效性。此外，还阐明了热源黑体温度、衬底材料、冰中气泡和衬底热条件对第一过程的影响。作为第二种工艺的模型，用激光从上方照射熔化带有微观孔洞的纯金属，熔融金属流入孔洞然后凝固，其中孔洞的尺寸非常小，必须考虑熔融金属的表面张力。对模型进行了分析和实验。分析结果与实验结果的比较表明，本文的分析可以定性地模拟第二过程。此外，对实际孔洞尺寸和时间尺度的分析结果显示了金属从熔化到凝固的瞬态行为。结果表明，表面张力是导致金属液流入微观孔的主要原因。

项目成果

Masashi OKADA, Isamu OHTA, and Koji MATSUMOTO: "Melting of semi-transparent Material Formed in Rectangular Hole by Means of Radiation" Proc.of 29th National Heat Transfer Symposium of Japan. 454-456 (1992)

Masashi OKADA、Isamu OHTA 和 Koji MATSUMOTO：“通过辐射在矩形孔中形成的半透明材料的熔化”第 29 届日本全国传热研讨会论文集。

Isamu OHTA, Masashi OKADA, Koji MATSUMOTO: "Radiative Melting of Ice in a Rectangular Dimple" Proc.of 4th Int. Symposium on Cold Regions Heat Transfer, Hanover USA. (1993)

Isamu OHTA、Masashi OKADA、Koji MATSUMOTO：“矩形凹坑中冰的辐射融化”Proc.of 4th Int。

岡田 昌志: "矩形くぼ地内に形成された半透過性物質の放射による融解" 第29回日本伝熱シンポジウム構演論文集(第29回日本伝熱シンポジウムに乙講演(92',5.28)).

Masashi Okada：“在矩形凹陷中形成的半透明材料的辐射诱导熔化”第 29 届日本传热研讨会论文集（第 29 届日本传热研讨会十月讲座（92，5.28））。

Isamu OHTA, Masashi OKADA, Koji MATSUMOTO: "Radiative Melting of a Semitransparent Material in a Rectangular Dimple" Tran.of Japan Society of Mechanical Engineers. 59-557. 161-168 (1993)

Isamu OHTA、Masashi OKADA、Koji MATSUMOTO：“矩形凹坑中半透明材料的辐射熔化”Tran.of 日本机械工程师学会。

Masashi OKADA, Jun OTSUKI, and Koji MATSUMOTO: "Melting of Metal with Microscopic Hole by Laser Radiation and Solidification of Molten Metal (Analysis with Consideration of Surface Tension)" Proc.of 30th National Heat Transfer Symposium of Japan. (1993)

Masashi OKADA、Jun OTSUKI、Koji MATSUMOTO：“通过激光辐射熔化具有微孔的金属和熔融金属的凝固（考虑表面张力的分析）”第 30 届日本全国传热研讨会论文集。