Research on Thermal Meromechanics of Electronic Packaging

电子封装热力学研究

• 批准号: 07455046
• 负责人: ISHIKAWA Hiromasa
• 金额: $ 3.97万
• 依托单位: HOKKIDO UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1995
• 资助国家: 日本
• 起止时间: 1995 至 1997
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07455046/
• 关键词: Electoronic Packaging; Microstructural Mechanics; Macrostructural Mechanics; Constitutive equation; Viscoplasticity; Creep; Solder Alloys; Fatigue Failure

Solder joints provide both electrical interconnection and mnechanical support. Therefore, the structural integrity of solder joints is a very inportant reliability concern. Especially, the fatigue resistance of near eutectic Pb-Sn solders is a major concern in the development of surface mount technology. Solder alloys, such as Pb-Sn solders are commonly used as high temperature. The solder alloys show strongly time dependent deformation, such as creep and strain rate effect in the high temperature regimes. Then, structural analysis and the estimation of strength of isothermal fatigue life demand a detail experimental observation and theoretical research on the viscous deformation of the solder alloy. In this research, the experimental and theoretical observation on fatigue, crack propagation and damage from both the macro and micro point of view. As a result, the following conclusions are obtained :(1) The stress-strain relation and yield sufaces of Pb-Sn solder alloy have strong strain rate effect and temperature effect.(2) The relationship between the number of cycle to fatigue failure and the plastic strain energy density can be expressed by a formula.(3) The constitutive model incorporating the creep effect was constructed in order to consider the change of microstructure of the solder alloy.(4) Using the constitutive model and the formula of the result (2), the method to estimate number of cycle to fatigue failure.(5) The possibility to construct more reliable method for the estimation of fatigue failure was found out, with more accuracy considering of microstructural change of the solder alloy in the constitutive model.

焊点既提供电气互连，又提供机械支撑。因此，焊点的结构完整性是一个非常重要的可靠性问题。尤其是近共晶铅锡焊料的抗疲劳性能是表面贴装技术发展中的一个重要问题。焊料合金，如铅锡焊料，通常用作高温。在高温区，焊料合金表现出强烈的时间相关变形，如蠕变和应变率效应。然后，为了进行结构分析和等温疲劳寿命强度估算，需要对焊料合金的粘性变形进行详细的实验观察和理论研究。本研究从宏观和微观两个角度对疲劳、裂纹扩展和损伤进行了实验和理论观察。结果表明：(1)铅锡焊料的应力应变关系和屈服面具有较强的应变率效应和温度效应。(2)疲劳破坏循环次数与塑性应变能密度之间的关系可以用公式表示。(3)为了考虑焊料微观组织的变化，建立了考虑蠕变效应的本构模型。(4)利用本构模型和结果(2)的公式，建立了含蠕变效应的本构模型。在本构模型中更准确地考虑了焊料合金的微观组织变化，找到了构建更可靠的疲劳失效估计方法的可能性。

项目成果

K.Ohguchi: "Fatigue Failure of 60Sn-40Pb Solder Alloys and Its Prediction Using Constitutive Model for Cyclic Plasticity" Proceedings of Fifth International Symposium on Plasticity and Its Current Application. 1. 637-640 (1995)

K.Ohguchi：“60Sn-40Pb 焊料合金的疲劳失效及其使用循环塑性本构模型的预测”第五届国际塑性及其当前应用研讨会论文集。

大口健一: "繰返し粘塑性構成式を用いた60Sn-40Pb材の疲労寿命予測" 日本機械学会論文集A編. 第62巻(予定). (1996)

Kenichi Oguchi：“使用循环粘塑性本构方程预测 60Sn-40Pb 材料的疲劳寿命”，日本机械工程学会会刊，第 A 卷，第 62 卷（计划）（1996 年）。

K.Ohguch, K.Sasaki and H.Ishikawa: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions JSME A. 62. 500-506 (1996)

K.Ohguch、K.Sasaki 和 H.Ishikawa：“使用循环粘塑性本构模型预测 60Sn-40Pb 焊料的疲劳失效” Transactions JSME A. 62. 500-506 (1996)

Hiromasa Ishikawa, Katsuhiko Sasaki and Ken-ichi Ohguchi: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions of ASME,Journal of Electronic Packaging. 118. 164-169 (1996)

Hiromasa Ishikawa、Katsuhiko Sasaki 和 Ken-ichi Ohguchi：“使用循环粘塑性本构模型预测 60Sn-40Pb 焊料的疲劳失效”ASME 交易，电子封装杂志。

H. Ishikawa: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transaction of ASME, Jounal of Electronic Packaging. Vol. 118. 164-169 (1996)

H. Ishikawa：“使用循环粘塑性本构模型预测 60Sn-40Pb 焊料的疲劳失效”ASME 交易，电子封装杂志。