Research about the adhesion fatigue of the resin material to dentin and enamel

采用不同的粘接系统，将各种复合树脂粘接到牙本质表面和牙釉质表面。将这些试件在水中长期放置后，检测其粘接强度。在大多数粘接系统中，在水中保持较长时间后，它在牙本质侧面临的粘接强度显著下降。向牙釉质一侧的粘附力已经下降，尽管它是基于在朝这个方向的水中保持很长时间的基础上的。至于试件在水中保存三年后的粘接强度，正在进行检测。由于HEMA基粘接系统在渗透到牙本质的过程中在口腔中变湿的条件下具有良好的性质，因此许多粘接系统都使用HEMA基粘接系统，这种粘接系统在粘接早期很容易获得高粘接强度。然而，这本HEMA指出，防水是有缺陷的。这种由于决定长期暴露在水中的粘连而逐渐恶化的可能性被认为是口腔内的HEMA基粘结系统。以提高耐水性为目的而研制的实验底漆在使用时，水中粘接强度的下降要经过两年的储存期才能察觉到。由此提出，使用这种耐水底漆可以提高长期粘接强度的稳定性，这对今后粘接系统的发展具有重要意义。

Various composite resins were made to adhere to the dentin surface and the enamel surface by using various bonding systems. An adhesive strength was examined after these specimems were kept for a long time during the water. The adhesive strength that it faced on the dentin side declined remarkably by keeping it for a long time during the water in most bonding systems. An adhesive strength toward the enamel side haedly declined though it was based on keeping it for a long time during the water toward this. As for the adhesive strength as well after specimen is kept during the water until three years, it is being examined. Because it has excellent nature on the condition that it became wet in the oral cavity in the permeation to the dentin, HEMA-based bonding system that a high adhesive strength can be easy to get in the adhesion early days is being used as for many bonding system. However, it is pointed out with this HEMA that water-resistancy has a fault. The possibility which deteriorates gradually because it decides to be exposed to the adhesion rest in the water for a long time is thought HEMA -based bonding system inside the oral cavity. When the experimental primer developed for the purpose of the improvement of water resistance was used, the decline of the adhesive strength wasn't recognized in the water until a storage period two years.It thought with the thing which gave it the suggestion that the fact that the stability of the adhesive strength of a long time could be improved by using water-resistant PRIMER like this was important to future bonding systems development.