Development of Directionally Aligned SiC Whisker Grinding Wheel

定向排列碳化硅晶须砂轮的研制

• 批准号: 08455074
• 负责人: YAMAGUCHI Katusmi
• 金额: $ 5.57万
• 依托单位: Nagoya University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1996
• 资助国家: 日本
• 起止时间: 1996 至 1997
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-08455074/
• 关键词: SiC whisker; Directional alignment; Grinding wheel; Grinding ratio; Lapping; Sistered diamond; Tool wear; Fatigue wear; 砥石; ウィスカ-; 研磨; SiC; 表面あらさ; 研削比; 目づまり; 研磨液

Grinding wheel made of the directionally aligned SiC whiskers was produced and its grinding characteristics were examined.Grinding characteristics of the resinoid, vitrified, metal and glass bonded wheels were tested and it was clarified that the resinoid wheel showed the best performance in the surface finish. Next, the authors succeeded in developing a loading free-grinding method in which free grains were mixed with grinding fluid, and overcoming a weak point of SiC whisker wheel. Futhermore, these wheel was applied to the lapping process, and very smooth surfaces of the hardened die steel and Si wafer were obtained.In addition to these experiments, tool wear were investigated in cutting the resinoid wheel. As the results, the effect of whisker size, shape and orientation on the tool wear were made clear and new model of wear mechanism due to fatigue was proposed.

制作了定向排列SiC晶须制成的砂轮并检验了其磨削特性。测试了树脂砂轮、陶瓷砂轮、金属砂轮和玻璃砂轮的磨削特性，结果表明树脂砂轮在表面光洁度方面表现出最好的性能。接下来，作者成功地开发了一种将游离颗粒与磨削液混合的无负载自由磨削方法，并克服了SiC晶须砂轮的弱点。此外，这些砂轮被应用于研磨过程，并获得了硬化模具钢和硅片的非常光滑的表面。除了这些实验之外，还研究了切割树脂砂轮时的刀具磨损。结果明确了晶须尺寸、形状和方向对刀具磨损的影响，并提出了疲劳磨损机制的新模型。

项目成果

JED.Afaghani: "Teat-off Wear Mechanism of Sintered Diamond Tool in Cutting SiC Particle StrengthendEpoxy Composite" Wear. 206. 221-229 (1997)

JED.Afaghani：“烧结金刚石刀具在切割 SiC 颗粒强化环氧复合材料时的咬断磨损机制”磨损。

I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap (in Japanese)" Journal of Society of Gringing Engineers. Vol.41.No.11. 428-433 (1997)

I.Horaguchi：“使用定向对齐 SiC 晶须研磨的表面精加工工艺（日语）”《磨削工程师学会杂志》。

I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap" ICPE '97TAIPE,TAIWAN Int.Conf.on Precision Engineering. 437-442 (1997)

I.Horaguchi：“使用定向对齐 SiC 晶须研磨的表面精加工工艺” ICPE 97TAIPE，台湾精密工程国际会议。

山口勝美: "方位配列炭化ケイ素ウィスカ-砥石の研磨特性" ニューセラミックス. 11. 7-11 (1997)

Katsumi Yamaguchi：“方位角排列的碳化硅晶须 - 砂轮的抛光性能”《新陶瓷》11. 7-11 (1997)。

K.Yamaguchi: "Grinding with Directionally Aligned SiC Whisker Wheel (Loading-Free Grinding)" American Society for Precision Engineering 12th Annual Meeting. Vol.16. 258-261 (1997)

K.Yamaguchi：“用定向排列的 SiC 晶须轮进行磨削（无负载磨削）”美国精密工程学会第 12 届年会。