IMPROVEMENT OF WETTING BEHAVIORS BETWEEN METAL AND CERAMICS BY USING INTERFACIAL SCIENCE

潮湿的行为是与不同领域有关的重要和物理现象。Particularlv，这是一个重要的问题，因为电子陶瓷是由电子金属湿润的，以便使电子陶瓷通过电子材料执行它们的功能。这个领域，不管是什么，似乎都是以人们的经历和没有科学观点为基础的，而且情况也没有像今天那样改变。氧气的局部压力支付了对大气层的影响的注意，而在另一方面，对非湿的要求有时也会出现。非湿材料应该被开发为任何熔化的铁流中的漏斗材料，对于实例。在微观领域，用金属或陶瓷涂层颗粒上的湿行为是必需的。基于这些背景，我专注于陶瓷和金属之间的界面，并假定湿行为作为微观现象，并以电子支架进行讨论。其中一种方法是通过计算机模拟进行对界面的分析。根据该模拟结果，该模拟与实验中的接触角度有关，指示湿行为直接。（1）在氧化物基质的情况下，表面氧化物给予和使用电子，将金属原子放置在陶瓷上。（2）金属和氧之间的债券订单，以指示在Al和Sn的案例中呈现的Ag和Cu比那些更大的价值。而Ti-Metal的债券顺序在Ag和Sn中也具有较大的价值，与Al和Sn相比。（3）在实验中，银和铜的接触角约为90 °和130 °，在Al和Sn的情况下。作为结果，湿行为被发现与金属原子和物质中的原子之间的电子转移有关。

Wetting behaviors are an important and physical phenomena relating to various fields. Particularlv, it is important that electronic ceramics is wetted by an electrode metal in order to let the electronic ceramics perform their functions through the electrode on the electronic material. The field, however, is seemed to be s strongly based on people's experiences and no scientific view points, and the situations have not been changed as of today. Oxygen partial pressure is paid attention for effects of atmosphere to be reported on it. On the other hand, the requirement for non-wetting is seen sometime. Non- wetting material should be developed for the material of hopper in which melted iron flows, for instances. In microscopic field, the wetting behaviors for coating on particle by metal or ceramics is required.Based on these backgrounds, I focused on the interfaces between ceramic and metal , and considered wetting behaviors as microscopic phenomena and discussed with electronic stand points. One of methods was analysis of the interfaces by a computer simulation. The results by the simulation were related to the contact angles in experiments indicating wetting behaviors directly.(1) the surface oxygen gives and takes electrons with a metal atom placed on the ceramics in the case of oxide substrate.(2) Bond orders between metal and oxygen indicating the bonding strength presented larger values in Ag and Cu than those in the cases of Al and Sn. And the bond orders of Ti-Metal were also larger values in Ag and Sn as compared to Al and Sn.(3) In experiments, the contact angles of Ag and Cu were about 90゜ and about 130゜ in case of Al and Sn. As results, wetting behaviors were found to be relating to the electron transferring between a metal atom and an atom in substrate.