Analysis for thin film delamination process and inverse analysis system considering a fine microstructure of interface and interfacial energy

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In the present study, we pursued to estimate an adhesive force by constructing a model of thin film delamination and considering a microstructure at the interface. The delamination process is similar to the adhesion one from a microscopic view. Hence, we made a program for simulation of a thin film adhesion process using BEM to simulate the delamination process. Molecular force was taken into account in the adhesion process. JKR theory has been compared with the experimental results and demonstrated the validity of algorithm of program. Then, an adhesion between a cylinder and a half-plane was analyzed using the program, the validity of the program was examined by comparing with the results based on JKR theory. A governing equation of displacement and coordinates of node were divided by an equilibrium length of atoms. Consequently, an accuracy and stability of calculation could be kept. The following results were deduced in the investigation1. The validity and utilization of the present study could be shown through a comparison of adhesion radius and the maximum adhesive force deduced in our study with those in other adhesive theory2. An adhesion between a cylinder with an uneven surface and a flat surface was analyzed. When the cylinder with the uneven surface was pressed down to the flat surface, the cylinder adhered to the flat surface keeping the distance of equilibrium length of atoms. It was found that the maximum adhesion force is proportional to the number of uneven of surface through the comparison of the maximum adhesion force, the radius of adhesion region and the surface traction3. A new adhesion theory for nano size domain was presented considering surface stresses and surface energy