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A study on a joining mechanism of the inteface between two different polymer in a reaction field which is formed by high-intensity ultrasonic wave

A study on a joining mechanism of the inteface between two different polymer in a reaction field which is formed by high-intensity ultrasonic wave
高强度超声波反应场中两种不同聚合物界面连接机理研究
批准号:
12650721
负责人:
MORI Kiyomi
金额:
$2.24万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2000
资助国家:
日本
项目状态:
已结题
起止时间:
2000 至 2001

项目摘要

项目成果

相关文献

中文摘要
翻译
1.我们制作了一个用于连接熔融型塑料试件的剪切模式连接系统和一个用于连接非熔融型塑料试件的剪切模式连接系统。研究了一种高效换能器的装配方法。研究结果表明,该传感器采用小螺距螺杆是合适的.对连接过程考虑的研究分为温升机理和连接机理两个阶段。(1)建立了剪切振动条件下的温升机理模型。并在此基础上进行了仿真计算。因此,温度上升在较低频率下主要由摩擦引起,而在较高频率下则由粘性引起。此外,我们还发现试样的摩擦系数越小,接合面的温升越高。(2)为了阐明连接机理,我们用电子能谱(ESCA)研究了连接部分的分子结构。此外,我们还进行了接头强度测试,并利用扫描电镜设备对接头强度测试后的试样断口进行了观察。从这个调查中,我们得出的结论是,加入机制分为三类。这是新的分子组合互扩散和锚效应的产生。
英文摘要
1. We made a longitudinal-mode joining system for joining of melting-type plastic specimens and a shear-mode system for non-melting plastic specimens. We also studied the assembling method for a high-efficiency transducer. It was find that usage of fine-pitch screw is suitable for the transducer.2. The study of the consideration of the joining process was divided into two stages of temperature rise mechanism and joining mechanism.(1) The model of the temperature rise mechanism was made under the shear-mode vibration conditions. The simulations, which are based on the model, were carried out. Consequently, the temperature rise is caused mainly by friction at lower frequencies and that is caused by viscosity at the higher frequencies. Moreover, we found that lower friction coefficient of the specimen makes higher temperature rise of the joining surface.(2) In order to clarify the joining mechanism, we investigated the molecule structure of the joined part by means ef X-ray analysis method (ESCA). Furthermore, we carried out the joint strength testing and observations of fractured part of the specimens after joint strength testing by means of SEM equipment. From this investigation, we conclude that the joining mechanism is divided into three categories. these are production of new molecular combination interdiffusion and anchor effect.
期刊论文(19)
专著(0)
科研奖励(0)
会议论文
Yuji Watanabe: "Ultrasonic Joining of Nonadhesive and Nonfusible Plastic"Proceeding of autumn meeting of axoustical society of Polymer processing. 213-214 (2000)
Yuji Watanabe:“非粘性和非熔性塑料的超声波连接”聚合物加工轴声学会秋季会议论文集。
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Kazumi Watanabe: "Heat Generation Mechanism in Ultrasonic Welding by a Torsional Vibrator"Seikei-Kakou. Vol.12, No.10. 655-661 (2000)
Kazumi Watanabe:“扭转振动器超声波焊接中的发热机制”Seikei-Kakou。
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Tomohiro Hatkeyama,: "Ultrasonic joining of polymidi sheet and copper plate using a lateral face of rod vibrating longitudinally at 19kHz"Technical Report of The Institute of Electronics, Information and Communication Engineers, US2000-16. 27-32 (2000)
Tomohiro Hatkeyyama,:“使用以 19kHz 纵向振动的杆的侧面对聚酰胺片材和铜板进行超声波连接”,电子、信息和通信工程师协会的技术报告,US2000-16。
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畠山友宏,渡辺裕二: "19kHz振動系を用いたポリイミドと銅の超音波接合における接合条件の検討"電子情報通信学会 信学技報. US2000-11. 27-32 (2000)
Tomohiro Hatakeyama、Yuji Watanabe:“使用 19kHz 振动系统对聚酰亚胺和铜进行超声波键合的键合条件研究”IEICE 技术报告,US2000-11 (2000)。
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