权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

A study on a joining mechanism of the inteface between two different polymer in a reaction field which is formed by high-intensity ultrasonic wave

高强度超声波反应场中两种不同聚合物界面连接机理研究

基本信息

批准号：
12650721
负责人：
MORI Kiyomi
金额：
$ 2.24万
依托单位：
TAKUSHOKU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-12650721/
关键词：
Uitrasonic Uitrasonic ioining Joning welding plastic friction vibration surface analysis 溶接テフロン

项目摘要

1. We made a longitudinal-mode joining system for joining of melting-type plastic specimens and a shear-mode system for non-melting plastic specimens. We also studied the assembling method for a high-efficiency transducer. It was find that usage of fine-pitch screw is suitable for the transducer.2. The study of the consideration of the joining process was divided into two stages of temperature rise mechanism and joining mechanism.(1) The model of the temperature rise mechanism was made under the shear-mode vibration conditions. The simulations, which are based on the model, were carried out. Consequently, the temperature rise is caused mainly by friction at lower frequencies and that is caused by viscosity at the higher frequencies. Moreover, we found that lower friction coefficient of the specimen makes higher temperature rise of the joining surface.(2) In order to clarify the joining mechanism, we investigated the molecule structure of the joined part by means ef X-ray analysis method (ESCA). Furthermore, we carried out the joint strength testing and observations of fractured part of the specimens after joint strength testing by means of SEM equipment. From this investigation, we conclude that the joining mechanism is divided into three categories. these are production of new molecular combination interdiffusion and anchor effect.

1. 我们制作了用于连接熔融型塑料样本的纵向模式连接系统和用于非熔融型塑料样本的剪切模式系统。我们还研究了高效换能器的组装方法。结果表明，传感器适合采用细牙螺钉。 2．连接过程考虑的研究分为温升机理和连接机理两个阶段。(1)建立了剪切模式振动条件下的温升机理模型。进行了基于模型的模拟。因此，温升主要是由较低频率下的摩擦引起的，而在较高频率下则是由粘度引起的。此外，我们发现试件的摩擦系数越低，接合表面的温升越高。(2)为了阐明接合机理，我们利用X射线分析方法(ESCA)研究了接合部分的分子结构。此外，我们还利用SEM设备进行了接头强度测试以及接头强度测试后试件断裂部分的观察。通过这次调查，我们得出结论，加入机制分为三类。这些都是新的分子组合相互扩散和锚定效应的产生。