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Electronic Structure of Homo-phase Grain Boundaries and Correlated Percolation -Fundamental Understanding of Transport Property and Nano-scale Microstructure Control of Composite Superconductors-

同相晶界的电子结构及相关渗流-复合超导体输运特性与纳米尺度微观结构控制的基本认识-

基本信息

批准号：
13305045
负责人：
OSAMURA Kozo
金额：
$ 3万
依托单位：
KYOTO UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

1.Sample preparation and microstructure observation : in order to make clear the degree of texturing, the polycrystalline Bi2223 films were prepared on the textured Ag substrate, Mg0 or SrTi03 single crystal. The crystal orientation was investigated by means of EBSP and the microstructural features of grain boundaries have been precisely analyzed by using SEM and EPMA. The crystal growth technique to prepare the [0011 oriented Bi2223 film with 1 micron-meter was established.2.Measurement and analysis of critical currents : the current - voltage relationship has been investigated at the micro-area by using the patterned samples. Its angular dependence of magnetic field and the strain dependence in Y123 thin films were precisely measured. The temperature dependence of critical current was measured in Bi2223 films. Their experimental data were applied to Weibull analysis. The high performance Bi2223 thin film with critical current density higher than 1 MA/m2 at 77 K has been developed.3.A … More nalysis of critical current of Bi2223 tape by using Weak Link Path model : the optimum percolation path in the sample has been estimated based on the model. The J-E curve obtained by computer simulation was compared with the experimental data. From the comparison, some microstructure factors like (a) current concentration, (b) clustering of non-SC links, (c) distribution of non-SC clusters have been elucidated.4.Improvement of transport property in the polycrystalline samples based on the Weak Link Path model : the optimization of transport properties was considered from the theoretical calculation based on the model. As a result, the microstructure model to realized the optimum property in Bi2223 tapes was proposed, where the grain boundary weak link limits the critical current.5.Mechanical property and its influence to critical current in Bi2223 tapes : the mechanical property of Bi2223 tapes was analyzed based on the rule of mixture by taking into consideration about the thermal residual stress. The true stress exerted on the SC oxide layer was made clear. In the stress region up to 60 MPa, the critical current reversibly decreased with increasing stress. This phenomenon was attributed to the SNS junction of the weak link at homo-phase grain boundaries. Less

1.样品制备和微观结构观察：为了明确织构化程度，在织构化的Ag衬底、Mg 0或SrTi 0 3单晶上制备多晶Bi 2223薄膜。用电子背散射（EBSP）技术研究了晶体取向，用扫描电镜（SEM）和电子探针（EPMA）分析了晶界的微观结构特征。2.临界电流的测量与分析：利用图形化样品研究了微区的电流-电压关系。精确测量了Y123薄膜的磁场角度依赖性和应变依赖性。测量了Bi_（2223）薄膜的临界电流随温度的变化。将实验数据进行Weibull分析。研制了77 K临界电流密度大于1 MA/m2的高性能Bi 2223薄膜。 ...更多信息用弱连接路径模型分析Bi 2223带材的临界电流：根据该模型估算了样品中的最佳渗流路径。将计算机模拟得到的J-E曲线与实验数据进行了比较。通过比较，阐明了电流浓度、非SC链的聚集、非SC团簇的分布等微观结构因素。4.基于弱连接路径模型的多晶样品输运性质的改善：从理论计算的角度考虑了输运性质的优化。在此基础上，提出了实现Bi 2223带材最佳性能的微观组织模型，其中晶界弱连接限制了临界电流。5. Bi 2223带材的力学性能及其对临界电流的影响：基于混合规则，考虑热残余应力，分析了Bi 2223带材的力学性能。明确了施加在SC氧化层上的真实应力。在应力高达60 MPa的区域，临界电流可逆地随应力的增加而降低。这一现象是由于在同质相晶界的薄弱环节SNS结。少

项目成果

期刊论文数量（17）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

Numerical analysis of the inhomogeneous current transport properties of Ag/Bi2223 tapes

Ag/Bi2223 带材非均匀电流传输特性的数值分析

DOI：
发表时间：
2003
期刊：
Phys.Rew. 67
影响因子：
0
作者：
K.Osamura et al.;K.Osamura et al.
通讯作者：
K.Osamura et al.

The stage Behavior in Stress -Elongation Curve Multifilamentary Bi2223 Tapes

Bi2223复丝带的应力伸长曲线阶段行为

DOI：
发表时间：
2002
期刊：
Adv.Cryog.Eng. 48
影响因子：
0
作者：
K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;Z.G.Li;K.Osamura et al.;K.Osamura et al.;S.Miyake;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.
通讯作者：
K.Osamura et al.

K.Osamura et al.: "Three Stage Behavior in Stress-Elongation Curve of Multifilamentary Bi2223 Tapes"Adv. Cryog. Eng.. 48. 477-483 (2002)

K.Osamura 等人：“复丝 Bi2223 胶带应力伸长曲线的三阶段行为”Adv.

DOI：
发表时间：
期刊：
影响因子：
0
作者：
通讯作者：

T.Doi 他: "Biaxially Oriented Nd123 Films Prepaed on Textured Ag Tapes"IEEE Trans. Applied. Supercond. 11. 3130-3133 (2001)

T. Doi 等人：“在纹理银带上制备的双向 Nd123 薄膜”，IEEE Trans. 11. 3130-3133 (2001)。

DOI：
发表时间：
期刊：
影响因子：
0
作者：
通讯作者：

Biaxially Oriented NdBa_2Cu_3O_7 Films Prepared on {100}<001> Textured Ag Tapes without Any Buffer Layers

在没有任何缓冲层的 {100}<001> 纹理银带上制备的双向 NdBa_2Cu_3O_7 薄膜

DOI：
发表时间：
2001
期刊：
IEEE Trans.Applied.Supercond. 11
影响因子：
0
作者：
K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;Z.G.Li;K.Osamura et al.;K.Osamura et al.;S.Miyake;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.;T.Doi et al.
通讯作者：
T.Doi et al.