权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Development of Miniature Creep Testing for Environment Friendly Solders

环境友好型焊料微型蠕变测试的开发

基本信息

批准号：
13650109
负责人：
TAKADA Akio
金额：
$ 2.24万
依托单位：
Maizuru National College of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

Quality assurance of solder connections is an important subject for guaranteeing the reliability of the connections. This study determined the creep characteristics of lead and lead free solders by making extensive creep experiments.Creep deformation and creep rupture characteristics were presented for Sn-37Pa and Sn-95Pb solders. These lead solders were most commonly used. The effects of Sn content and temperature on creep and creep rupture were studied. The prediction method for creep deformation and rupture time was proposed as a function of stress, time and temperature.Creep deformation and rupture characteristics of Sn-3.5Ag was studied. The solder is the most potential lead free solder and is expected to be used in major electronics connections. The superior creep deformation resistance and rupture strength were experimentally found compared with Sn-37Pb and Sn-95Pb lead solders. From the viewpoint of creep performance, Sn-3.5Ag solder was verified to be available in actual solder connections.Size effect in solder creep was investigated. A new miniature creep tester was developed for making creep tests for miniature specimens. There was almost no size effect in solder creep to the specimen diameter down to 1 mm but there was a clear size effect below that diameter. A large scatter in creep rate and rupture time was found in specimens with diameters of 0.3 and 0.5 mm whereas almost no scatter was confirmed in bulk specimens. The creep rupture times of miniature specimens were predictably from those of bulk specimens by considering a factor of two allowable band with Sn-37Pb solder.

焊点质量保证是保证焊点可靠性的重要课题。本文通过大量的蠕变实验，测定了无铅和无铅钎料的蠕变特性，给出了Sn-37 Pa和Sn-95 Pb钎料的蠕变变形和蠕变断裂特性。这些铅焊料是最常用的。研究了Sn含量和温度对合金蠕变和持久性能的影响。提出了蠕变变形和持久时间随应力、时间和温度变化的预测方法，研究了Sn-3.5Ag合金的蠕变变形和持久特性。该焊料是最有潜力的无铅焊料，预计将用于主要的电子连接。与Sn-37 Pb和Sn-95 Pb铅焊料相比，其抗蠕变性能和抗断裂强度均具有上级特点。从蠕变性能的角度出发，验证了Sn-3.5Ag钎料在实际焊点中的可行性，研究了钎料蠕变的尺寸效应。研制了一种用于小型试样蠕变试验的微型蠕变试验机。对于直径低至1 mm的样本，焊料蠕变几乎没有尺寸效应，但在该直径以下存在明显的尺寸效应。直径为0.3和0.5 mm的试样的蠕变速率和断裂时间有较大的分散性，而在大块试样中几乎没有分散性。通过考虑Sn-37 Pb焊料的两个允许带的因素，微型试样的蠕变断裂时间可从大块试样的蠕变断裂时间预测。