Copper metallization of aromatic polymer film surfaces used for flexible printed circuit boards

用于柔性印刷电路板的芳香族聚合物薄膜表面的铜金属化

• 批准号: 13650949
• 负责人: INGAKI Norihiro
• 金额: $ 2.24万
• 依托单位: Shizuoka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650949/
• 关键词: Printed circuit board; Armatic polymers; Copper metallization; Plasma treatment; Surface modification; アラミド

Aromatic polymers such as polyimide and poly(oxybenzoate-co-oxynaphthoate) were modified with direct and remote plasmas, and the effects of the modification on the adhesion between the copper layer and the modified film surface were investigated for flexible printed circuit boards. The plasma treatment led to a noticeable decrease in the contact angle, which was mainly due to the C-O functional groups on the surfaces. The modification by the plasma was effective in improving the adhesion with copper metal. The peel strength for the copper/polymer system was enhanced from 10 to more than 500 mN/5 mm by the surface modification.

采用直接等离子体和远程等离子体对聚酰亚胺和聚（羟基苯甲酸酯-羟基萘甲酸酯）等芳香族聚合物进行改性，研究了改性对柔性印刷电路板铜层与改性膜表面附着力的影响。等离子体处理导致接触角显著降低，这主要是由于表面上的C-O官能团。等离子体改性能有效地提高涂层与金属铜的结合力。铜/聚合物体系的剥离强度由10 mN/5 mm提高到500 mN/5 mm以上。

项目成果

N.Inagaki, S.Tasaka, K.Narushima, H.Kobayashi: "Surface modification of PET films by pulsed argon plasma"Journal of Applied Polymer Science. 85. 2845-2852 (2002)

N.Inagaki、S.Tasaka、K.Narushima、H.Kobayashi：“脉冲氩等离子体对 PET 薄膜进行表面改性”应用高分子科学杂志。

N.Inagaki, S.Tasaka, K.Narushima, and K.K.Teranishi: "Surface modification of poly(tetrafluoroethylene) with pulsed hydrogen plasma"Journal of Applied Polymer Science. vol.83. 340-348 (2001)

N.Inagaki、S.Tasaka、K.Narushima 和 K.K.Teranishi：“用脉冲氢等离子体对聚四氟乙烯进行表面改性”应用高分子科学杂志。

S.K.Lim and N.Inagaki: "Surface modification of Thermotropic poly(oxybenzoate-co-oxynaphthaoate) copolymer by remote oxygen plasma for copper metallization"Journal of Applied Polymer Science. vol.88. 2400-2408 (2003)

S.K.Lim 和 N.Inagaki：“通过远程氧等离子体对热致聚（羟基苯甲酸酯-共-羟基萘甲酸酯）共聚物进行表面改性以实现铜金属化”应用聚合物科学杂志。

S.K.Lim, N.Inagaki: "Surface modification of thermotropic poly(oxybenzoate-co-oxynaphthoate) coplymer by remote oxygen plasma for copper metalization"Journal of Applied Polymer Science. 88. 2400-2408 (2003)

S.K.Lim，N.Inagaki：“通过远程氧等离子体对热致聚（羟基苯甲酸酯-共-羟基萘甲酸酯）共聚物进行表面改性以实现铜金属化”应用聚合物科学杂志。

N.Inagaki, S.Tasaka, T.Baba: "Surface modification of polyimide film surfaces by silane coupling reactions for copper metallization"Journal of Adhesion Science Technology. 15. 749-762 (2001)

N.Inagaki、S.Tasaka、T.Baba：“通过硅烷偶联反应对聚酰亚胺薄膜表面进行表面改性以实现铜金属化”粘合科学技术杂志。