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Bond strength of adhesive cement to Ag-Pd-Au-Cu alloys

胶粘剂与Ag-Pd-Au-Cu合金的粘结强度

基本信息

批准号：
13672057
负责人：
GOTO Shin-ichi
金额：
$ 2.3万
依托单位：
The Nippon Dental University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2003
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13672057/
关键词：
Casting alloy Silver alloy Bond strength Resin cement XPS Adhesion mechanism Microstructure EPMA 表面性状

项目摘要

Six alloy compositions (Ag:30-50%, Pd:20-30%, Cu:10-20%) were selected, out of the organization that developed the multi-function alloy. Eighteen alloys that added 0,2,4% of Sn to these alloys were used for the adhesion test. The specimens were prepared using an ordinary dental casting procedure. The surface of the specimen was finished with #800 SiC paper. The adhesive cement, Superbond C&B was applied to the specimen following the manufacturer's instruction. The measurement of the bond strength was carried out for three times for each alloy composition. Many of the tested alloys had higher bond strength (more than 40MPa) than commercially available silver-based palladium gold alloys.Either 0,2,4% Sn, Ga or In was added to nine alloy compositions (20%Au,20,30 or 40%Pd,10,15 or 20%Cu and Ag as balance) and a total of 63 alloys were prepared. Superbond was used as an adhesive cement and the bond strength was measured for these alloys. The bond strength of the mother composition alloys, that of Sn-added alloys, that of Ga-added alloys and that of In-added alloys were in the range of 33.1-42.5 MPa, 35.9-45.9 MPa, 38.4-44.1 MPa and 42.2-47.3 MPa, respectively.Panavua21EX with alloy primer was used as an adhesive cement and the bond strength was measured for these alloys. The bond strength of the mother composition alloys, that of Sn-added alloys, that of Ga-added alloys and that of In-added alloys were was in the range of 21.8-41.6 MPa, 19.4-43.2 MPa, 18.1-33.9 MPa and 18.6-42.9 MPa, respectively.The elemental analysis using XPS showed that Ag, Pd, Cu, Sn, Ga and In in the alloy were oxidized for all 63 alloys tested. In the alloys added with either Sn, Ga or In, the oxidation of Ag, Pd and Cu was limited and the additives were selectively oxidized.

从开发多功能合金的组织中选择六种合金成分（Ag：30- 50%，Pd：20- 30%，Cu：10-20%）。将向这些合金中添加0%、2%、4%的Sn的十八种合金用于粘附性测试。使用普通牙科铸造程序制备样本。样品的表面用#800 SiC纸抛光。按照制造商的说明书将粘合剂Superbond C&B施加到样品上。对于每种合金组合物进行三次结合强度的测量。在9种合金成分（20%Au、20%Pd、30%Cu、40%Pd、10%Cu、15%Cu和20%Ag）中分别加入0%、2%、4%的Sn、Ga或In，制备了63种合金。Superbond被用作粘合剂水泥，并测量这些合金的粘结强度。采用Panavua 21 EX作为粘结剂，测试了母合金、加锡合金、加镓合金和加铟合金的粘结强度，其粘结强度分别为33.1- 42.5MPa、35.9- 45.9MPa、38.4- 44.1MPa和42.2- 47.3MPa。母合金、加Sn合金、加Ga合金和加In合金的结合强度分别为21.8- 41.6MPa、19.4- 43.2MPa、18.1- 33.9MPa和18.6- 42.9MPa。对于所有63种测试合金，合金中的Ga和In被氧化。在添加Sn、Ga或In的合金中，Ag、Pd和Cu的氧化受到限制，并且添加剂被选择性氧化。