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フラーレンを利用した耐摩耗性材料の開発に関する研究

富勒烯耐磨材料的开发研究

基本信息

批准号：
13750084
负责人：
米倉大介
金额：
$ 1.34万
依托单位：
The University of Tokushima
依托单位国家：
日本
项目类别：
Grant-in-Aid for Young Scientists (B)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

本研究は,従来のものよりも優れた摩耗特性を有する炭素系薄膜材料の開発を目的としたものである.昨年度はマイクロ波プラズマCVD装置を用いて鋼の上に耐摩耗性に優れた炭素系薄膜の成膜を試みたが,基板温度が800℃以上の高温になりダイヤモンドもしくは熱分解炭素が成膜された.成膜条件を変化させ熱分解炭素以外の炭素系薄膜の作成を試みた結果,ガラス状炭素を作ることができた.これらの薄膜についてベアリング鋼を相手材として摩擦摩耗試験を行ったところ,熱分解炭素,ガラス状炭素は摩擦係数は低いが,耐摩耗性が極めて低いことがわかった.この原因は処理中の基板温度が高すぎること,薄膜中の水素量が多いこと,基板との密着強度が低いことが考えられる.そこで,既存のCVD装置を改造し,プラズマと基板との距離をとり,バイアス電圧を印可することで基板の温度上昇の抑制を試みた.その結果,基板は500℃以下に保たれ熱分解炭素の生成は抑制できたが、摩擦摩耗特性の改善には至らなかった.そこで本年度は薄膜中の水素量が少なく耐摩耗性に優れた薄膜を高い密着力で被覆することを目的として,グラファイトターゲットを用いたAIP法でAr中での成膜を行った.その結果,AIP法で成膜した薄膜はDLCのラマンスペクトルを示し,その特性はマイクロ波CVD法で作成したものよりも平滑,高硬度,高弾性率となることがわかった.また,スクラッチ試験によって基板との密着性を評価した結果,臨界荷重値はL_<cII>=6.0〜7.2であった.このような薄膜を用いて摩擦試験を行った結果,摩擦係数は0.2程度と優れた特性を示したが、基板との密着性が低いため短い距離ではく離してしまった.そこで,様々な成膜条件で成膜を行い,密着性の向上を図ったが密着力の大幅な改善はできなかった.このような問題に対してはSiの中間層の導入などが必要となるものと考えられる.

In this study, the friction characteristics of carbon thin film materials have been studied. Last year, the CVD device was used to prepare carbon films with high temperature, high temperature and high temperature. Under the condition of film formation, the chemical decomposition of carbon films other than carbon films were used to make the results of the test results, and the carbon in the form of carbon was used as the chemical composition of carbon. Thin film, low friction, low friction. The reason is that the temperature of the substrate is high, the amount of water in the film is high, and the substrate is dense with low strength. The existing CVD equipment is revamped, the substrate is far away from the environment, and the printing of the electronic printing can be used to suppress the temperature of the substrate. The results showed that the carbon decomposition of the substrate below 500 ℃ resulted in the inhibition of carbon decomposition and the improvement of friction and friction characteristics. This year, the film contains less water, less water The results showed that the film was formed by AIP method, the film was formed by DLC method, and the characteristic was measured by CVD method. The results show that the film is smooth, high hardness and high performance. In order to improve the performance of the substrate, the results show that the load is very high, and the load is very high. In this paper, the results show that the load of the substrate is very high, and the results show that the load is very high. In this paper, the results of the results show that the load of the substrate is very high. The results show that the load of the substrate is very high. The results show that the load of the substrate is very high. The results show that the load is very high, and the load is very high. The results show that the friction coefficient of the film is 0.2, and that of the substrate is low tightness and short distance distance. In order to improve the film-forming conditions, the film-forming conditions, adhesion, adhesion and adhesion. If you have any questions, please enter the necessary information in the Si.