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Active Printed Circuit Boards/Three-Dimensional Micro Optical Switching Systems and Resource-Saving Device Integration Processes

有源印刷电路板/三维微型光开关系统和资源节约型器件集成工艺

基本信息

批准号：
14550041
负责人：
YOSHIMURA Tetsuzo
金额：
$ 2.11万
依托单位：
Tokyo University of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2002
资助国家：
日本
起止时间：
2002 至 2004
项目状态：
已结题

项目摘要

In order to reduce size/cost of optical interconnects within boxes, we proposed "Three-Dimensional(3-D) Stacked Optoelectronic(OE) System LSI" and "3-D Micro Optical Switching System (3D-MOSS)" based on the following strategies : constructing 3-D architecture, embedding thin-film devices into waveguide films, and forming self-organized inter-film optical wiring. We obtained results described below.1.3D-MOSS can achieve 1024x1024 optical switching with a system size of-1.4x0.6 cm^2 and insertion loss of 29 dB, which correspond to an occupation area reduction of 3/100 and loss reduction of 14 dB comparing with the conventional planar structure.2.A resource-saving device integration process "Photolithographic Packaging with Selectively-Occupied Repeated Transfer (PL-Pack with SORT)," which integrates different types of active elements into one substrate in desired distributions using all-photolithographic process, was found to be able to decrease consumption of embedded functional materials down to 1/10〜1/10000, resulting in drastic cost reduction. The proof-of-concept of the process was demonstrated experimentally.3.Waveguide films with surface-normal mirrors were fabricated by the built-in mask method. The method will realize cost-effective mass production of waveguide films with fine-pitch micro mirrors of arbitrary directions with maximized positional accuracy and with minimized processing cost. The proof-of-concept of the process was demonstrated experimentally.4.To reduce fabrication cost of optical Z-connections, we proposed to apply Self-Organized Lightwave Network(SOLNET) to the vertical waveguide formation. The beam propagation method reveals that, while 25% waveguide misalignment in film assembly raises the insertion loss up to 73 dB in 3D-MOSS, SOLNET can reduce it down to 31 dB. Experimental works demonstrated high coupling efficiencies of SOLNET with wide tolerance, indicating that SOLNET is effective for 3-D optical wiring construction.

为了减小盒内光互连的尺寸和成本，我们提出了基于以下策略的“三维（3-D）堆叠光电（OE）系统LSI”和“3-D微型光开关系统（3D-MOSS）”：构建3-D结构、将薄膜器件嵌入波导膜中以及形成自组织膜间光布线。1.3D-MOSS可以实现1024 × 1024的光开关，系统尺寸为-1.4 × 0.6 cm ^2，插入损耗为29 dB，与传统的平面结构相比，其对应于3/100的占用面积减小和14 dB的损耗减小。利用全叠层工艺将不同类型的有源元件以所需的分布集成到一个衬底中的”占用重复转移（PL-Pack with SORT）“被发现能够将嵌入式功能材料的消耗降低到1/10 - 1/10000，从而大幅降低成本。通过实验验证了该工艺的可行性。3.采用内置掩模法制备了表面法向反射镜波导薄膜。该方法将以最大的位置精度和最小的加工成本实现具有任意方向的细间距微镜的波导膜的成本有效的大规模生产。为了降低Z型光连接的制作成本，提出了将自组织光波网络（SOLNET）应用于垂直波导的制作。光束传播法表明，虽然膜组件中25%的波导错位使3D-MOSS中的插入损耗提高到73 dB，但SOLNET可以将其降低到31 dB。实验结果表明，SOLNET耦合效率高，容差宽，是一种有效的三维光布线结构。