Interface Fracture Mechanics of Laminates and Its Application to Design of LSI Packages

层压板界面断裂力学及其在LSI封装设计中的应用

• 批准号: 14550083
• 负责人: TOYA Masayuki
• 金额: $ 1.92万
• 依托单位: Kagoshima University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2002
• 资助国家: 日本
• 起止时间: 2002 至 2003
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-14550083/
• 关键词: laminates; interface fracture mechanics; delamination growth; energy release rate; impact loading; temperatyre gradient; LSI package; 積層材料; はく離; 低速度衝撃; 熱的負荷

1.Delamination growth due to mechanical and thermal loadings is investigated for laminates consisting of two beams with different elastic and thermal properties.Two basic models, which are important for the fracture mechanics of interface of laminates, are analyzed.(1)The low velocity impact applied normal to the surface of laminated beam with an edge delamination is considered.The dynamical response of the beam is analyzed on the basis of the theory of transient vibration due to time varying externally applied force.The condition of the velocity of impacting bar is assumed as such that the velocity becomes constant after some short transient time.The magnitude of impacting force is then determined by making use of Laplace transform method.The bending moments near the edge of delamination are obtained in closed form, from which the energy release rate is calculated.Experiments are also conducted, which show that the predicted response of the beam agree well with the theory.(2)Delamination growth due to temperature gradient is analyzed for the beam with an internal delamination.It is shown that when the temperature gradient is below some critical value the model assuming the contact of the delaminated surfaces is effective and in this case energy release rate is identically zero.However, when the temperature gradient reaches some critical value, local delamination buckling occurs and energy release rate becomes no longer zero ; This implies that the delamination growth would occur only through the local delamination buckling.2.Numerical analyses based on FEM and experiments are made for delamination growth in large-scale integrated circuits(LSI)plastic packages.Using Kr 85 radioactive tracer techniques, initial sites of edge delaminations occurring during temperature cyclic tests in LSI plastic packages areidentified and the results are compared with analyses.

1.研究了由两根弹性和热性能不同的梁组成的层合板在机械载荷和热载荷作用下的分层扩展。(1)考虑了垂直于层合梁表面的低速冲击。根据时变外力作用下的瞬时振动理论，分析了梁的动力响应。假定冲击杆的速度在一段短暂的瞬变时间后变为恒定速度。然后利用拉普拉斯变换确定冲击力的大小。用闭合形式得到分层边缘附近的弯矩，由此计算能量释放率。还进行了实验。结果表明，当温度梯度低于某一临界值时，假定脱层表面接触的模型是有效的，此时能量释放率为零，但当温度梯度达到某一临界值时，局部脱层屈曲发生，能量释放率不再为零；基于有限元和实验对大规模集成电路(LSI)塑料封装的分层扩展进行了数值分析，利用Kr-85放射性示踪技术识别了LSI塑料封装在温度循环试验过程中出现的边缘分层的起始点，并与分析结果进行了比较。

项目成果

Fukagawa Kazuyoshi, Aritomi Masao, Oda Mikio, Toya Masayuki: "An Interface Crack in a Laminated Beam Subject to Thermal Gradient"Journal of the Society of Materials Science, Japan.. Vol.53. 518-525 (2004)

Fukakawa Kazuyoshi、Aritomi Masao、Oda Mikio、Toya Masayuki：“受热梯度影响的层压梁中的界面裂纹”日本材料学会期刊。第 53 卷。

深川和良: "温度こう配下における異種材積層はり中のはく離"材料(日本材料学会論文集). 53巻、5号(掲載予定). (2004)

Kazuyoshi Fukakawa：“温度梯度下异种材料层压梁的分层”材料（日本材料学会论文集）第 53 卷，第 5 期（即将出版）。

深川和良: "温度こう配下における異種材積層はり中のはく離"材料. 53. 518-525 (2004)

Kazuyoshi Fukakawa：“温度梯度下异种材料层压梁的分层”材料 53. 518-525 (2004)。

Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya: "Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading"Trans.ASME, Journal of Electronic Packaging. Vol.125. 420-425 (2003)

Takehiro Saitoh、Hidehito Matsuyama、Masayuki Toya：“温度循环加载下 LSI 塑料封装中的分层和封装树脂开裂”Trans.ASME，电子封装杂志。

Takehiro Saito: "Delamination and Encapusulant Resin Cracking in LSI Plastic Package Subjected to Temperature Cyclic Loading"Trans.ASME, J.Electronic Packageing. 125. 420-425 (2003)

Takehiro Saito：“温度循环载荷下 LSI 塑料封装中的分层和封装树脂开裂”Trans.ASME，J.Electronic Packageing。