Gas leakage through C/C composite and its suppression technology
Gas leakage through C/C composite and its suppression technology
批准号:
16360338
负责人:
HATTA Hiroshi
金额:
$7.87万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2004
资助国家:
日本
项目状态:
已结题
起止时间:
2004 至 2005
中文摘要
Carbon fiber reinforced carbon matrix composites(C/Cs)are porous materials including voids,cracks,and interfacial debonding between the fiber and matrix。Hence,in applications of C/Cs to airtight hot structures such as heat exchangers,the gas leakage becomes serious problem。However,within author‘s best knowledge,few studies has treated this problem,and essentially no discussion has been performed on gas leak mechanisms and measures to minimize gas leak rate.In the present study,the following discussion was performed;1.A test fixture capable of high temperature measurement of gas leak rates was designed,and fabricated.2..In order to fill the defects in C/Cs,molten Si was infiltrated,and filled Si was converted to SiC by chemical reaction with carbon in C/Cs.3。Cracks in C/Cs have tendency to be closing with temperature rise,so that additional measures which can be done under low temperature environment were attempted.The results obtained in the present research were as follows;1.A test fixture capable of high temperature gas leak rate measurements up to 800°C of gas leak rates was designed,and fabricated.2.The Si impregnation resulted in decreasing gas leak rate to1/10.3。As low temperature methods,carbon infiltration by HIP(Hot Isostatic Pressure),glass formation by the sol-gel method,and glass coating by the sol-gel method were examined after the Si impregnation。The first method resulted in slight lowering of gas leak rate,the second and third treatments yielded less gas leak rates over 1/10 compared with Si impregnated C/Cs。Thus,this study established technology lowering gas leak rate through C/Cs less than1/1000compared with non-treated C/Cs。
英文摘要
Carbon fiber reinforced carbon matrix composites (C/Cs) are porous materials including voids, cracks, and interfacial debonding between the fiber and matrix. Hence, in applications of C/Cs to airtight hot structures such as heat exchangers, the gas leakage becomes serious problem. However, within author's best knowledge, few studies has treated this problem, and essentially no discussion has been performed on gas leak mechanisms and measures to minimize gas leak rate.In the present study, the following discussion was performed ;1. A test fixture capable of high temperature measurement of gas leak rates was designed, and fabricated.2. In order to fill the defects in C/Cs, molten Si was infiltrated, and filled Si was converted to SiC by chemical reaction with carbon in C/Cs.3. Cracks in C/Cs have tendency to be closing with temperature rise, so that additional measures which can be done under low temperature environment were attempted.The results obtained in the present research were as follows ;1. A test fixture capable of high temperature gas leak rate measurements up to 800゜C of gas leak rates was designed, and fabricated.2. The Si impregnation resulted in decreasing gas leak rate to 1/10.3. As low temperature methods, carbon infiltration by HIP (hot isostatic pressure), glass formation by the sol-gel method, and glass coating by the sol-gel method were examined after the Si impregnation. The first method resulted in slight lowering of gas leak rate, the second and third treatments yielded less gas leak rates over 1/10 compared with Si impregnated C/Cs. Thus, this study established technology lowering gas leak rate through C/Cs less than 1/1000 compared with non-treated C/Cs.
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Key C/C technologies required for building up an engine structure for a reusable space vehicle
建造可重复使用航天器发动机结构所需的关键 C/C 技术
DOI:
--
发表时间:
2005
期刊:
Proc. USA France and Japan Carbon-Carbon Composites Technology Exchange Workshop CD ROM
影响因子:
--
作者:
[Yoshisato Kimura, Akihisa Zama, Hiroshi Hatta]
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通过浸硅防止 C/C 复合材料气体泄漏
DOI:
--
发表时间:
2004
期刊:
Proc. 5TH JOINT CANADA-JAPAN WORKSHOP ON COMPOSITES, 2004 CD ROM
影响因子:
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DOI:
--
发表时间:
2005
期刊:
Proc. International Conference on Interfaces & Interphases in Multicomponent Materials CD ROM
影响因子:
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通过硅浸渍防止 C/C 复合材料的气体泄漏,
DOI:
--
发表时间:
2004
期刊:
Proc.5TH JOINT CANADA-JAPAN WORKSHOP ON COMPOSITES
影响因子:
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批准号:22360283
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负责人:HATTA Hiroshi
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依托单位:
海外基金