Microstructure control of monotectic hybrid powders for developing multi-functional properties

用于开发多功能特性的偏晶杂化粉末的微观结构控制

• 批准号: 19360338
• 负责人: OHNUMA Ikuo
• 金额: $ 12.81万
• 依托单位: Tohoku University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2007
• 资助国家: 日本
• 起止时间: 2007 至 2009
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-19360338/
• 关键词: 状態図; 熱力学データベース; 液相2相分離; CALPHAD; 粉末; 電子材料; 熱力学デースベース

Miscibility gap in liquid phase in the Ag-Cu-X (X=Ni, Co, Fe) ternary systems was predicted and composition of the ternary alloys was optimized by thermodynamic calculation. Ingots were prepared by induction melting and powdered by gas-atomizing method. Consequently, each spherical particle of the powders exhibits egg-type microstructure, whose periphery and core consist of high-conductive Ag-rich phase and Cu-X phase, respectively. Obtained powders were sintered at 700～900℃ to form massive samples and their resistivity was measured to evaluate their potential for the high-conductive material. Resistivity of some sintered Ag-Cu-X alloys stacks up with a sintered pure Ag sample. It was found that Ag-rich phase decomposed from Cu-X core of particles as well as Ag-rich periphery forms dense and continuous network of the Ag-rich matrix, which results in the decrease of resistivity of sintered materials.

对Ag-Cu-X （X=Ni, Co, Fe）三元体系液相混相间隙进行了预测，并通过热力学计算优化了三元合金的组成。采用感应熔炼法制备钢锭，采用气雾化法制备粉末。因此，粉末的每个球形颗粒都呈现出卵状微观结构，其外围和核心分别由高导电性富银相和Cu-X相组成。将所得粉体在700~900℃下烧结成块状试样，测定其电阻率，评价其作为高导电材料的潜力。一些烧结Ag- cu - x合金的电阻率与烧结的纯Ag样品相叠加。结果表明，从Cu-X颗粒核心分解出的富银相以及外围的富银相形成了致密连续的富银基体网络，从而降低了烧结材料的电阻率。

项目成果

Experimental investigation and thermodynamic calculation in the Ag-Bi-Ni and Cu-Bi-Ni systems

• DOI: 10.1557/jmr.2009.0302
• 发表时间: 2009-08
• 期刊: Journal of Materials Research
• 影响因子: 2.7
• 作者: F. Gao;Cuiping Wang;Xingjun Liu;Y. Takaku;I. Ohnuma;K. Ishida

Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap

• DOI: 10.1007/s11664-008-0537-x
• 发表时间: 2009-01-01
• 期刊: JOURNAL OF ELECTRONIC MATERIALS
• 影响因子: 2.1
• 作者: Ohnuma, I.;Saegusa, T.;Ishida, K.
• 通讯作者: Ishida, K.

Development of Thermodynamic Database for Cu-base Alloy Systems and Micro-Solders

铜基合金系统和微焊料热力学数据库的开发

• 发表时间: 2009
• 作者: I.Ohnuma;C.P. Wang;X.J.Liu;K.Ishida
• 通讯作者: K.Ishida

偏晶型Ag基合金粉末の相平衡と焼結体の電気抵抗特性

单晶银基合金粉末的相平衡及烧结体的电阻性能

• 发表时间: 2008
• 作者: 高久佳和;三枝拓朗;大森俊洋;大沼郁雄;貝沼亮介;石田清仁
• 通讯作者: 石田清仁

Thermodynamic assessment of phase equilibria in the Sn-Au-Bi system with key experimental verification

Sn-Au-Bi 体系中相平衡的热力学评估及关键实验验证

• DOI: 10.1557/jmr.2010.0056
• 发表时间: 2010-03
• 期刊: Journal of Materials Research
• 影响因子: 2.7
• 作者: Kiyohito Ishida;X.J. Liu;F. Gao;C.P. Wang;Yoshikazu Takaku;Ikuo Ohnuma
• 通讯作者: Ikuo Ohnuma