Research on three dimensional wiring by 3-D patterning and vertical shape forming technologies.

点击翻译按钮获取中文摘要

The spray coating and inclined UV light exposure technologies were examined to realize the three dimensional wiring pattern. Also, electroplating condition was examined to form the wiring. The technologies were applied to the Chip on Glass optical module. The resistance of the wiring is 0.1～0.2Ω, and also reliability was good. As the result, these technologies can be applicable to the three dimensional wiring. Further, the high aspect ratio vertical Si shape could be formed by the unisotropic wet etching.