吸引キャビテーション流を利用する水晶ウエハの超精密三次元マイクロ砥粒加工法の開発

点击翻译按钮获取中文摘要

The abrasive machining using a cavitation in reversing suction flow, in which slurry squirts against a wafer urface perpendicularly from a restrictor nozzle by suction of slurry in a machining chamber, is formulated in this study. Machining effect in the developed method and suitable machining conditions of quarts wafers are investigated. Wafer surface profile is dominated in several nanometer revel by the nozzle diameter and the nozzle clearance. The form accuracy of wafer surface is improved by addition of rotating mechanism in a wafer setting stage.