Study for degradation of 1-step adhesive systems affected by residual solvents

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This study evaluated relationship between bonding performance of 1-step adhesive systems and residual solvent contained in the systems. Bond strengths of the systems were decreased in the both cases of so much residual solvent existed and too much solvent was removed. Optimal amount of the solvents differed in each systems.In addition, bonding durability of the 1-step adhesive systems was also evaluated after20,000 times of thermal cycling or 12 months of water storage. As the results of that, there was no statistical difference after thermal cycling. However, significant decrease in tensile bond strengths were observed after 12 months of water storage, and the decrease was differ in each adhesive systems.