Effect of solvent in 1-step self-etching adhesives on degree of conversion and long-term durability

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Objective. The objectives of the present study were 1) to clarify the relationship between the duration of air-drying for one-step self-etch adhesives (1-SEA) and evaporation degree (ED) of solvents, and 2) to evaluate the effect of ED on the ultimate micro-tensile strength (UTS) of the adhesives. Methods. The ED of three 1-SEA, iBond (Heraus kulzer), G-BOND (GC) and S3 BOND (kuraray), after 0, 5 and 10 sec air-drying was decided by gravimetric method. After that, the UTSs of the adhesives at ED equivalent to 0, 5 and 10 sec air-drying were evaluated. Results. EDs were increased by extension of air-drying time. As for the comparison between the adhesives, iBond showed the largest ED, and followed by G-BOND and S3 BOND. Regarding UTS, longer air-drying time resulted in larger UTS. In comparison between the adhesives, S3 BOND (HEMA containing adhesive) showed larger UTS than the other two adhesives (HEMA-free adhesives). Significance. Air-drying had a significant effect to remove solvents included in 1-SEAs and to achieve larger UTS of them. Hence, it might be crucial to remove solvents as much as possible by thorough, strong air-drying for firmly hardened adhesive layer at the interface.