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Study on three dimension magnetic sensor module using film bonding technology

采用薄膜接合技术的三维磁传感器模块研究

基本信息

批准号：
21560373
负责人：
KOH Keishin
金额：
$ 2.16万
依托单位：
Kanagawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2009
资助国家：
日本
起止时间：
2009 至 2011
项目状态：
已结题

项目摘要

In order to estimate the magnetic properties of superconducting materials, the three-axis magnetic sensor with small size and planar structure is necessary. We propose the novel fabrication technology of three-axis magnetic sensor based on Hall sensor using semiconductor film bonding technologies, in which the GaAs semiconductor film was released from mother substrate, and bonded it on the metal electrode surface formed on the dielectric or Si substrate, and x, y, z axis Hall sensor was fabricated. We investigated the process conditions such as the fabrication conditions of through substrate Via, fabrication conditions of three-axis Hall sensor, and estimated the basic characteristics of the three-axis Hall sensor. The results indicated possibility of the technology.

为了估计超导材料的磁性能，需要小尺寸、平面结构的三轴磁传感器。我们提出了一种基于霍尔传感器的三轴磁传感器的新型制造技术，即利用半导体薄膜键合技术将GaAs半导体薄膜从母片上释放出来，并将其键合在介质或Si衬底上形成的金属电极表面上，从而制备出x、y、z轴霍尔传感器。研究了三轴霍尔传感器的工艺条件，如通基板Via的制备条件和三轴霍尔传感器的制备条件，并估计了三轴霍尔传感器的基本特性。结果表明了该技术的可行性。