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Study on three dimension magnetic sensor module using film bonding technology

采用薄膜接合技术的三维磁传感器模块研究

基本信息

批准号：
21560373
负责人：
KOH Keishin
金额：
$ 2.16万
依托单位：
Kanagawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2009
资助国家：
日本
起止时间：
2009 至 2011
项目状态：
已结题

项目摘要

In order to estimate the magnetic properties of superconducting materials, the three-axis magnetic sensor with small size and planar structure is necessary. We propose the novel fabrication technology of three-axis magnetic sensor based on Hall sensor using semiconductor film bonding technologies, in which the GaAs semiconductor film was released from mother substrate, and bonded it on the metal electrode surface formed on the dielectric or Si substrate, and x, y, z axis Hall sensor was fabricated. We investigated the process conditions such as the fabrication conditions of through substrate Via, fabrication conditions of three-axis Hall sensor, and estimated the basic characteristics of the three-axis Hall sensor. The results indicated possibility of the technology.

为了对超导材料的磁特性进行测量，需要一种小型平面结构的三轴磁敏传感器。提出了一种基于半导体薄膜键合技术的霍尔传感器的三轴磁敏传感器制作新工艺，将GaAs半导体薄膜从母基板上剥离，键合在介质或Si基板上形成的金属电极表面，制作出x、y、z轴霍尔传感器。我们研究了工艺条件，如通过衬底通孔的制作条件，三轴霍尔传感器的制作条件，并估计了三轴霍尔传感器的基本特性。结果表明了该技术的可行性。