Debonding of adhesive resin by means of decomposition reaction of photocatalyst
Debonding of adhesive resin by means of decomposition reaction of photocatalyst
批准号:
22659352
负责人:
SAWASE Takashi
金额:
$2.13万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Challenging Exploratory Research
财政年份:
2010
资助国家:
日本
项目状态:
已结题
起止时间:
2010 至 2012
中文摘要
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英文摘要
The purpose of this study is to decrease adhesive force as necessary. The experimental results revealed that bond strength was significantly decreased when ultraviolet rays is irradiated to the substrate materials coated with titanium dioxide.
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